Counter-Flow Substrate Support for Thermal Uniformity
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Solution Overview
Problem
Conventional substrate processing methods often result in undesirable temperature profiles, leading to suboptimal process results due to inadequate thermal uniformity across substrates.
Innovation Solution
The apparatus includes a substrate support with a flow path system that utilizes a counter-flow configuration of heat transfer fluid, featuring multiple flow paths with equivalent axial lengths and spacings to enhance thermal uniformity and control temperature profiles across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling channels are used in substrate support, then cooling function is provided, but temperature uniformity across the substrate deteriorates
Solution Approach 1:
The flow path is divided into multiple segments (first portion and second portion) with different flow directions. This segmentation allows different regions of the substrate support to receive cooling fluid in opposite directions, enabling independent temperature control in different zones to achieve overall temperature uniformity across the substrate.
Solution Approach 2:
The invention uses counter-flow configuration where the heat transfer fluid flows in opposite directions in adjacent portions of the flow path. This inversion of flow direction in different regions compensates for temperature gradients, with cooler fluid directed toward hotter regions and warmer fluid toward cooler regions, thereby achieving uniform temperature distribution.
2Temperature
If cooling channels are provided to maintain desired temperature profile, then thermal control is achieved, but temperature non-uniformity persists leading to suboptimal process results
Solution Approach 1:
Different portions of the flow path are configured with opposite flow directions to provide localized temperature control. The first portion and second portion deliver heat transfer fluid in opposite directions to address specific thermal conditions in different regions of the substrate support, achieving locally optimized temperature profiles that collectively ensure overall process quality and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves a more uniform temperature distribution across the substrate, reducing the temperature difference between maximum and minimum points and improving process consistency by increasing the flow rate and residence time of the heat transfer fluid.
Implementation Method 1
a flow path disposed within the substrate support to flow a heat transfer fluid beneath the support surface
Implementation Method 2
the first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion
Data Source
AI summary
Apparatus for controlling the thermal uniformity of a substrate can control the thermal uniformity of the substrate to be more uniform or to be non-uniform. In some embodiments, an apparatus for controlling the thermal uniformity of a substrate includes: a substrate support having a support surface to support a substrate thereon. A flow path is disposed within the substrate support to flow a heat transfer fluid beneath the support surface. The flow path comprises a first portion and a second portion, each portion having a substantially equivalent axial length. The first portion is spaced about 2 mm to about 10 mm from the second portion. The first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion.