Conductive Coupling Element for Shorter Wire Bonds
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Solution Overview
Problem
Existing electronic devices face inefficiencies in electrical connections between chip terminals, leads, and external components due to long wire bonding lengths, which affect performance and occupy excessive space on printed circuit boards, making it difficult to optimize size and cost.
Innovation Solution
The solution involves an electronic device with a conductive coupling element on the support element, allowing for efficient electrical connections between chip terminals and leads, and optionally incorporating electronic components directly on this coupling element, reducing wire bonding length and area occupation on the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect chip terminals to leads, then electrical connection is achieved, but inductance increases and connection length increases
Solution Approach 1:
The patent introduces a coupling element as an intermediary component between the chip terminals and the leads. This coupling element provides alternative connection paths that reduce wire bonding length and inductance, while maintaining reliable electrical connections. The coupling element acts as a mediator that enables shorter, more efficient signal paths.
2Reliability
If electronic components are mounted on external PCB, then electrical connections are established, but area occupation on PCB increases and distance from chip increases
Solution Approach 1:
The patent merges the electronic components with the package structure by mounting them on the coupling element, which is integrated into the package housing. This consolidation eliminates the need for separate external PCB mounting, reducing overall area occupation while maintaining functional connections. The components are combined within the same structural envelope.
Solution Approach 2:
The patent utilizes the vertical dimension within the package housing to accommodate electronic components on the coupling element. By arranging components in the vertical space rather than spreading them horizontally on an external PCB, the solution reduces footprint area while maintaining accessibility and functional connections to the chip.
3Temperature
If support element is sized for heat dissipation, then heat dissipation performance improves, but distance between chip and leads increases
Solution Approach 1:
The coupling element serves as an intermediary that bridges the gap created by the heat dissipation-focused support element design. It provides a platform for mounting electronic components and establishing electrical connections without requiring long wire bonds, thus decoupling the heat dissipation function from the electrical connection length issue.
Data Source
AI summary
An electronic device includes a chip and a support element which supports the chip. Leads are provided to be electrically coupled to at least one terminal of the chip. A coupling element is mounted to a free region of the support element that is not occupied by the chip. The coupling element includes a conductive portion electrically connected to at least one lead and to the at least one terminal of the chip to obtain an electrical coupling.