Flexible Display Cover Plate Leveling Layer
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Solution Overview
Problem
The challenge in manufacturing flexible display devices is to minimize the thickness of their assembly structure to achieve smaller bending radii while avoiding air bubbles in the adhesive layer caused by the decoration ink edges, which requires a thinner adhesive layer that can effectively bond the cover plate and display panel without increasing the overall thickness.
Innovation Solution
A manufacturing method involving a base substrate with an ink pattern layer and a curable liquid applied using coating processes like slit coating, spraying, or spin coating, which forms a cured layer that levels the ink pattern edges, allowing for a thinner adhesive layer to bond the cover plate and display panel, thereby reducing the assembly thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thicker adhesive layer is used to bond the cover plate and display panel, then air bubbles are avoided, but the overall thickness of the display assembly increases
Solution Approach 1:
The patent applies preliminary action by forming a leveling layer on the ink pattern layer before bonding. This leveling layer pre-compensates for the height differences caused by ink edges, allowing a thinner adhesive layer to be used without risking air bubble formation. The leveling layer is applied in advance to create a flat surface that eliminates the need for excessive adhesive thickness.
2Length of stationary object
If the thickness of the assembly structure is minimized, then smaller bending radii are achieved, but air bubbles form in the adhesive layer
Solution Approach 1:
The patent introduces an intermediary element - the leveling layer - between the ink pattern layer and the adhesive layer. This intermediary component mediates the conflict by providing a flat surface that prevents air bubble formation while allowing the overall assembly to remain thin. The leveling layer acts as a buffer that eliminates height variations without requiring a thick adhesive layer.
3Length of stationary object
If the adhesive layer is made thinner to reduce assembly thickness, then smaller bending radii are achieved, but air bubbles form due to ink edge height variations
Solution Approach 1:
The leveling layer is applied in advance to the ink pattern layer to eliminate height variations at the ink edges before the adhesive layer is applied. This preliminary action creates a uniformly flat surface that prevents air bubble formation even when using a thin adhesive layer, thus resolving the conflict between thinness and bubble-free bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of flexible display devices with thinner overall thickness and smaller bending radii by ensuring a flat surface for bonding, preventing air bubbles and maintaining a decorative appearance.
Implementation Method 1
the curable liquid is photo-curable, and the curable liquid is cured by UV irradiation to form the cured layer covering the ink pattern layer
Implementation Method 2
the curable liquid is heat curable, and the curable liquid is cured by heating to form the cured layer covering the ink pattern layer
Implementation Method 3
the coating process comprises any one of slit coating process
Implementation Method 4
the coating process comprises any one of slit coating process, spraying process
Implementation Method 5
the coating process comprises any one of slit coating process, spraying process, and spin coating process
Data Source
AI summary
A motherboard and a manufacturing method thereof, a cover plate and a manufacturing method thereof, and a display device are provided. The manufacturing method of the motherboard includes: forming an ink pattern layer on a base substrate, the ink pattern layer including a plurality of hollow regions; applying a curable liquid onto the base substrate to cover the ink pattern layer; and curing the curable liquid to form a cured layer covering the ink pattern layer.