Connector Bridges CPU Signal Paths to Reduce Degradation
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Solution Overview
Problem
As signal speeds in processor-based systems increase, ensuring the integrity of signals exchanged between components of computing devices becomes a challenge, particularly due to the length and number of pathways that signals must traverse.
Innovation Solution
A connector is introduced that bridges high-speed connections between CPU packages and other components, reducing signal pathway length by allowing direct communication and minimizing connection points, featuring multiple signal paths and various orientations such as a right angle configuration to place CPU packages closer together on a PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signals are transmitted through traditional PCB pathways between CPU packages, then connections can be established, but signal degradation increases due to longer pathway lengths
Solution Approach 1:
The patent introduces a connector as an intermediary component that provides dedicated high-speed signal pathways between CPU packages. This connector acts as a mediator that bypasses the traditional PCB trace routes, offering shorter and more direct signal paths that reduce degradation while maintaining reliable connections between processing units.
2Adaptability or versatility
If more connection points are used to route signals between CPU packages and components, then connectivity is improved, but signal integrity deteriorates due to increased connection points
Solution Approach 1:
The patent segments the connection system into two distinct pathways: a dedicated high-speed connector pathway for critical CPU-to-CPU and CPU-to-component communications, and the traditional PCB pathway for other connections. This segmentation allows high-speed signals to use the optimized connector path with fewer connection points, preserving signal integrity while maintaining overall system connectivity through the alternative PCB route.
3Ease of manufacture
If CPU packages are placed farther apart on the PCB, then routing is simpler, but signal transmission quality decreases due to longer pathways
Solution Approach 1:
The patent adds a third dimensional aspect to the connection architecture by introducing a separate connector component that bridges CPU packages. Instead of relying solely on the two-dimensional PCB layout, the connector provides a vertical or orthogonal connection path that bypasses the planar routing constraints, enabling short signal paths even when CPU packages are spaced apart for manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution maintains signal integrity by reducing signal degradation and enabling faster data exchange by minimizing the number of connection points and pathway lengths between CPU packages, thus enhancing overall system performance.
Implementation Method 1
The PCB may mechanically support and electrically connect the components using conductive pathways, tracks, or signal traces etched from a metal, such as copper
Implementation Method 2
using conductive or optical signal paths
Data Source
AI summary
Examples disclosed herein provide a computing assembly. The computing assembly includes a first CPU package mounted on a PCB, and a second CPU package mounted on the PCB. The computing assembly includes a connector to bridge a convection between a connection interface of the first CPU package and a connection interface of the second CPU package, wherein the connector comprises a plurality of signal paths for routing signals from the first and second CPU packages. The signals paths include a first signal path to route signals between the first and second CPU packages, and a second signal path to route signals between the first CPU package and another component.