Circuit Optical Details TRIZ Cases

Integrates a module supporting frame onto a substrate board via molding, eliminating tilt and flatness issues from separate adhesive bonding.

Segmented cladding layers form vertical channels that allow underfill resin to fill contact holes, preventing air expansion during heating.

Embedding wiring patterns inside the optical waveguide body eliminates additional solder resist layers, reducing vertical size and manufacturing cost.

Electrodeposition of a rhodium alloy on conductive tracks yields a gray-white appearance while maintaining corrosion resistance and mechanical strength.

A molded glass lid with AuSn solder bonds to a silicon wafer substrate for opto-electronic assemblies.

A surface-mounted optical device uses encapsulation to align waveguides within a printed circuit board aperture.

Overlapping source and control PCBs on display panel sides reduces bezel size while enabling transparent images.

A thermal conductive layer prevents gas bubbles and internal stress by ensuring uniform heat distribution across metal wirings during laser sealing.

A package substrate integrates a solder resist layer with high light transmittance to guide optical signals through the laminated body.

A rigidity reinforcing structure on a circuit substrate prevents electrical connection failures when the device bends.

Non-crosslinked thermoplastic polymers with high glass transition temperatures protect conductive patterns without causing adhesion failure or yellowing.

A feedback portion monitors output voltage to adjust the power source circuit and maintain consistent load voltages.

A conductive material combining a pi-conjugated polymer, fluorinated sulfo dopant, and metal oxide nanoparticles to enhance film-formability.

Polymer overcoats protect sparse metal conductive layers from mechanical wear, resolving brittleness issues in flexible touch sensors.

A reconstituted wafer assembly integrates optical waveguides into the base substrate for high-bandwidth data transmission.