Optical/Electrical Hybrid Substrate Wiring Integration
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Solution Overview
Problem
Conventional optical/electrical hybrid substrates have a larger vertical size and increased cost due to the placement of wirings on the clad layer, necessitating additional solder resist for protection.
Innovation Solution
The optical/electrical hybrid substrate integrates first and second wiring patterns within the optical waveguide body, with pads and vias on the clad layers, allowing the clad layers to function like solder resist, reducing the need for additional solder resist and minimizing vertical size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If wirings are provided on the clad layer, then electrical connection is achieved, but the vertical size increases and additional solder resist is required
Solution Approach 1:
The patent merges the wiring function with the optical waveguide body by embedding wiring patterns directly within it. This integration eliminates the need for separate wiring layers on the clad layer, thereby reducing vertical size while maintaining electrical connection functionality. The wiring patterns are formed inside the optical waveguide body, combining optical and electrical functions in a single structure.
Solution Approach 2:
The patent transitions wiring from a planar arrangement on the clad layer to a three-dimensional embedding within the optical waveguide body. By moving wiring patterns into the volume of the waveguide rather than placing them on its surface, the design achieves electrical connection without increasing the vertical footprint, effectively utilizing the third dimension for spatial optimization.
2Ease of operation
If wirings are provided on the clad layer, then electrical connection is achieved, but cost increases due to additional solder resist
Solution Approach 1:
The patent combines the wiring structure with the optical waveguide body, eliminating the need for separate solder resist layers that would be required to protect exposed wirings on the clad layer. This merger reduces the number of manufacturing steps and materials needed, thereby lowering production cost while maintaining electrical connection capability.
Solution Approach 2:
The patent extracts the wiring function from the external clad layer environment and embeds it within the optical waveguide body. This extraction eliminates the need for additional protective layers like solder resist, simplifying the manufacturing process and reducing cost by removing unnecessary materials and steps.
3Length of stationary object
If wiring patterns are integrated within the optical waveguide body, then vertical size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the optical waveguide body formation process into distinct stages, with wiring patterns being formed during specific processing steps. By dividing the manufacturing process into manageable segments, the integration of wiring within the waveguide body becomes more controllable and less complex, allowing for systematic production while maintaining compact vertical dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the vertical size and cost of the hybrid substrate by integrating wiring patterns within the optical waveguide, eliminating the need for additional solder resist and optimizing the use of clad layers.
Implementation Method 1
an optical waveguide body having a first clad layer, a core portion and a second clad layer. The core portion has a refractive index higher than refractive indices of the first and second clad layers
Implementation Method 2
a pair of mirrors for reflecting a light signal
Data Source
AI summary
In an optical/electrical hybrid substrate 10 including a wiring board 11 having a wiring and a via, and an optical waveguide 12 including an optical waveguide body 80 having a first clad layer 81, a second clad layer 83 and a core portion 82 disposed between the first clad layer 81 and the second clad layer 83 and provided on the wiring board 11, and a pair of mirrors 88 and 89 for reflecting a light signal, a first wiring pattern 96 for electrically connecting a terminal 117 of a light emitting device 13 for irradiating the light signal to the wiring and via, and a second wiring pattern 97 for electrically connecting a terminal 119 of a light receiving device 14 for receiving the light signal to the wiring and via, the first and second wiring patterns 96 and 97 are disposed in the optical waveguide body 80.