Molded Circuit Board for Camera Module Flatness
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Solution Overview
Problem
Conventional camera module manufacturing processes, such as COB, face issues with tilt and flatness problems due to poor quality of plastic supporting frames, leading to increased thickness, reduced miniaturization, and low production efficiency, along with dust accumulation and complex assembly processes.
Innovation Solution
A manufacturing equipment for molded circuit board assembly that integrates a module supporting frame onto a substrate board using a molding process, allowing for simultaneous formation of multiple substrate boards and improved structural strength, reducing thickness, and enhancing production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the holder is bonded to the circuit board via adhesive in the COB process, then the holder can be assembled on the circuit board, but the holder is prone to tilt and has optical eccentric phenomenon due to poor flatness
Solution Approach 1:
The patent merges the holder and circuit board into a single integrated structure where the holder is formed as an extension of the circuit board substrate. This eliminates the separate bonding process and ensures perfect flatness since there is no interface between two separate components. The integrated design resolves the tilt and optical eccentric issues caused by adhesive bonding of separate parts.
2Manufacturing precision
If excessive adhesive is preset between the holder and circuit board to leave adjustable space for active alignment, then the alignment requirement can be met, but the thickness of the camera module is increased
Solution Approach 1:
By integrating the holder and circuit board into one piece, the patent eliminates the need for adhesive layers and adjustment spaces. The unified structure provides inherent alignment precision without requiring additional thickness for bonding materials or adjustment mechanisms, thus resolving the contradiction between alignment precision and module thickness.
3Strength
If the circuit board is required to have a certain degree of structural strength as a basic base and supporting carrier, then the circuit board can provide adequate support, but the circuit board having a large thickness causes the thickness of the camera module increased
Solution Approach 1:
The patent employs composite material structures and optimized substrate designs that achieve high structural strength with reduced thickness. The integrated holder-circuit board structure allows for strategic reinforcement at critical areas while maintaining overall thinness, resolving the contradiction between needing structural strength and minimizing thickness.
4Ease of manufacture
If the holder is produced by a separate injection molding process, then the holder can be manufactured, but the holder has a poor flatness and the number of the holder that can be manufactured at a time is relative small
Solution Approach 1:
The patent combines the holder and circuit board into a single integrated component that is manufactured as one piece, eliminating the separate injection molding process for the holder. This integration ensures perfect flatness since the holder is formed as a continuous extension of the circuit board substrate, and enables larger batch production through unified manufacturing processes.
5Ease of manufacture
If the camera modules are assembled one by one during the assemble process, then the holder can be bonded to the circuit board, but the manufacturing process for the camera module is relatively complex and the production efficiency is relatively low
Solution Approach 1:
By integrating the holder and circuit board into one component, the patent simplifies the assembly process and enables batch manufacturing. Multiple integrated units can be produced simultaneously in a single manufacturing run, eliminating the need for sequential assembly operations and significantly improving production efficiency.
Data Source
AI summary
A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.