Flexible Transparent Conductive Films with Polymer Overcoats

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Solution Overview

Problem

Traditional transparent conductive films, such as those made from indium tin oxide (ITO), are brittle, costly to produce, and not suitable for flexible or thin electronic devices due to high temperature and vacuum requirements, as well as susceptibility to cracking on flexible substrates.

Innovation Solution

A double-sided conductive structure featuring a sparse metal conductive layer on each side of a thin transparent polymer substrate with a polymer overcoat, allowing for flexible and thin transparent conductive films with improved mechanical durability and optical properties, achieved through the use of fused metal nanostructured networks and specific processing techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If ITO is used as transparent conductive film, then high transparency and high conductivity are achieved, but the film becomes brittle and cracks easily on flexible substrates

Engineering Contradiction:

Improvemechanical durabilityVSAvoidflexibility

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent replaces rigid ITO ceramic films with flexible polymer-based transparent conductive films that can bend and stretch without cracking. The polymer matrix provides inherent flexibility while maintaining transparency and conductivity through embedded conductive particles or intrinsic conductive polymers.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The invention uses composite structures combining polymer materials with conductive elements (such as metal nanoparticles, nanowires, or conductive polymer blends) to achieve both flexibility and conductivity. This composite approach allows the material to exhibit both mechanical柔性和 electrical conductivity.

Inventive Principle:

Principle #40Composite materials

2Reliability

If ITO is deposited using sputtering process, then high quality transparent conductive film is formed, but the process requires high temperature and vacuum making it slow and costly

Engineering Contradiction:

Improvefilm qualityVSAvoidmanufacturing speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent replaces the complex vacuum sputtering mechanical system with simpler solution-based deposition methods such as dip-coating, spray-coating, or inkjet printing. These methods can be performed at atmospheric pressure and lower temperatures, significantly improving manufacturing speed and reducing equipment complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the deposition parameters from high-temperature vacuum conditions to low-temperature atmospheric conditions. This allows for faster processing cycles and enables deposition on temperature-sensitive flexible substrates that cannot withstand sputtering conditions.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If ITO is deposited using sputtering process, then high quality transparent conductive film is formed, but the process is costly and not cost effective

Engineering Contradiction:

Improvefilm qualityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs inexpensive polymer materials and conductive additives that can be processed using low-cost coating techniques. The flexible nature of these materials also allows for potential recycling or disposal without significant environmental impact, reducing overall manufacturing costs.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

By replacing expensive vacuum sputtering equipment with simple coating apparatus, the patent dramatically reduces capital expenditure and operational costs while maintaining acceptable film quality through optimized solution formulations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Length of moving object

If the polymer substrate thickness is reduced to make the film thinner, then flexibility is improved, but mechanical strength and durability decrease

Engineering Contradiction:

Improvesubstrate thicknessVSAvoidmechanical strength

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The patent uses composite polymer structures with reinforced phases or crosslinked networks that provide enhanced mechanical strength at reduced thickness. The conductive elements are distributed within the polymer matrix to create a reinforced composite structure that maintains strength while reducing overall thickness.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The invention develops ultra-thin flexible polymer films with optimized molecular structures that provide both flexibility and mechanical integrity. The polymer chains are arranged to provide inherent strength while maintaining thin profile and flexibility.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS11910525B2Thin flexible structures with surfaces with transparent conductive films and processes for forming the structures

Publication Date: 2024.02.20 EKC TECHNOLOGY INC

AI summary

Structures are described having thin flexible polymer substrates with electrically conductive films on each opposing surface while having high optical transmittance and good optical properties. The structures can have total thicknesses of no more than about 30 microns and good flexibility. Processing approaches are described that allow for the coating of the very thin structures by providing support through the coating process. The structures are demonstrated to have good durability under conditions designed to test accelerated wear for touch sensor use.