Transparent Display Device PCB Overlap and Groove Nesting
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Solution Overview
Problem
Existing transparent display devices face challenges in achieving a transparent image due to the necessity of placing driving circuit units on the rear surface, which increases the bezel size and thickness, compromising aesthetic appeal and spatial functionality.
Innovation Solution
The integration of a source printed circuit board (PCB) and a control PCB into a single board, with circuit films connected to the display panel in a way that the PCBs overlap each other, avoiding overlap with the display panel, and incorporating a groove for the timing controller to reduce thickness and enhance aesthetic appearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the driving circuit unit is disposed on the rear surface of the display panel, then the transparent image cannot be realized, but if it is disposed in another area, then the bezel size increases
Solution Approach 1:
The patent applies dimensional change by moving the driving circuit unit from the rear surface (2D plane) to the side surface of the display panel (3D space). This allows the circuit unit to be positioned in a different spatial dimension, enabling transparent image realization while containing the bezel within acceptable limits through vertical stacking arrangement.
Solution Approach 2:
The patent implements nesting by placing the driving circuit unit inside a groove structure on the side surface of the display panel. The groove acts as a container that houses the circuit unit, effectively nesting it within the display panel's structural envelope rather than allowing it to protrude externally, thus minimizing bezel increase.
2Device complexity
If the source PCB and control PCB are arranged in parallel on the rear surface, then the structure is simple, but the transparent image cannot be realized and the thickness increases
Solution Approach 1:
The patent transitions from a planar parallel arrangement (2D) to a three-dimensional stacked arrangement where the source PCB and control PCB are positioned on opposite sides of the display panel in the vertical dimension. This dimensional change enables transparent image realization while maintaining structural organization through systematic stacking.
Solution Approach 2:
The patent merges the source PCB and control PCB into an integrated assembly that works together as a unified driving circuit system. By combining these functional units and positioning them on opposite surfaces of the display panel, the design achieves transparent image capability while managing overall device complexity through functional integration.
3Ease of manufacture
If the timing controller is mounted on the surface of the PCB, then the manufacturing is simple, but the thickness increases compromising aesthetic appearance
Solution Approach 1:
The patent applies nesting by creating a groove structure in the PCB that receives and houses the timing controller. This groove acts as a recessed container that embeds the timing controller within the PCB thickness rather than allowing it to protrude, thereby maintaining a sleek external appearance while preserving manufacturing simplicity through the integrated groove design.
Solution Approach 2:
The patent moves the timing controller from a surface-mounted position (2D plane) to a three-dimensional position within a groove structure. This spatial repositioning allows the controller to be accommodated within the PCB's vertical profile, reducing the overall thickness while maintaining ease of manufacture through the groove integration.
Data Source
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AI summary
Disclosed is a display device for realizing a transparent image. The display device includes a display panel, a source printed circuit board (PCB) on which a signal line is mounted, a control PCB on which a timing controller is mounted, and a circuit film connected to the display panel at one side of the circuit film and connected to the source PCB at the other side. The source PCB and the control PCB are disposed to overlap each other, and the source PCB and the control PCB are disposed not to overlap the display panel.