Encapsulation Structure Thermal Conductive Layer for Laser Sealing
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Solution Overview
Problem
Conventional encapsulation techniques for display panel devices face issues with uneven heating during laser sealing due to differences in thermal conductivity between metal wirings and substrate materials, leading to gas bubble formation and internal stress, which can cause the sealing structure to break.
Innovation Solution
A thermal conductive layer is introduced, electrically insulated from the metal pattern, to uniformly distribute heat during the laser sealing process, ensuring consistent heating and preventing defects in the sealing structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser sealing is performed directly on frit plastic covering metal wirings, then sealing process can be completed, but uneven heating occurs due to thermal conductivity differences causing gas bubbles and internal stress
Solution Approach 1:
A thermal conductive layer is introduced as an intermediary between the metal wiring and the frit plastic. This layer has high thermal conductivity to evenly distribute laser heat and prevent localized overheating, while also having low electrical conductivity to maintain electrical insulation. The intermediary layer resolves the contradiction by enabling uniform sealing without compromising structural integrity.
Solution Approach 2:
The thermal conductive layer is made of composite material possessing both high thermal conductivity and low electrical conductivity. This composite material simultaneously addresses the thermal management requirement for uniform sealing and the electrical insulation requirement, preventing gas bubble formation and internal stress while maintaining sealing structure integrity.
2Ease of manufacture
If metal wirings are directly covered by frit plastic, then connection terminals can be led out, but thermal conductivity differences cause uneven heating and gas bubble formation
Solution Approach 1:
The thermal conductive layer serves as an intermediary that enables the laser sealing process to proceed uniformly. It allows the frit plastic to be properly sealed while preventing the thermal conductivity mismatch from causing uneven heating, thus maintaining both ease of manufacture and sealing precision.
Solution Approach 2:
The thermal conductive layer changes the thermal parameters in the sealing region by providing a intermediate thermal conductivity value between the metal wiring and frit plastic. This parameter modification ensures uniform heat distribution during laser sealing, preventing gas bubble formation while maintaining encapsulation processability.
3Manufacturing precision
If high thermal conductivity material is used under frit plastic, then uniform heating is achieved, but electrical insulation may be compromised
Solution Approach 1:
The thermal conductive layer is composed of composite material that simultaneously provides high thermal conductivity for uniform heat distribution and low electrical conductivity for maintaining electrical insulation. This composite material resolves the contradiction by satisfying both thermal and electrical requirements.
Solution Approach 2:
The thermal conductive layer exhibits local quality differentiation where it provides high thermal conductivity in the thermal conduction direction while maintaining low electrical conductivity. This localized property distribution allows uniform heating without compromising electrical insulation, resolving the contradiction between manufacturing precision and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents defects in the sealing structure, enhances the sealing performance of frit plastic, and improves the reliability of the encapsulation by maintaining uniform heat distribution and maintaining original circuit connections.
Implementation Method 1
a thermal conductive layer, at least covering the metal pattern and electrically insulated from the metal pattern
Implementation Method 2
the sealing structure is formed from a frit plastic on the sealing region by a laser sealing process
Data Source
Figure 1~2
Figure 3~5
AI summary
An encapsulation structure and a related display apparatus are provided. The encapsulation structure includes a first substrate(10) having a sealing region, a metal pattern(11) on the sealing region, a thermal conductive layer(12), at least covering the metal pattern(11) and electrically insulated from the metal pattern(11), and a sealing structure(21) on the thermal conductive layer(12).