Rigidity Reinforcing Structure for Flexible Circuit Substrate
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Solution Overview
Problem
Circuit substrates in portable electronic devices with image-sensing chips face structural weakness and surface irregularities, leading to electrical connection failures such as short-circuits and open-circuits when bent, due to the damage in the connection relationship between the image sensing chip and the circuit substrate.
Innovation Solution
Incorporating a rigidity reinforcing structure on the circuit substrate, with perpendicular projections of conductive substrate and chip contacts on this structure, enhances the structural strength and surface flatness, thereby preventing electrical connection failures when the substrate is bent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the circuit substrate is made flexible for portable device design, then the adaptability and portability are improved, but the structural strength and electrical connection reliability deteriorate when bent
Solution Approach 1:
The patent applies local quality by placing a rigidity reinforcing structure only in specific regions where conductive substrate contacts and conductive chip contacts are located. This localized reinforcement maintains flexibility in other areas while providing necessary structural support and electrical connection reliability at critical points.
Solution Approach 2:
The patent uses composite materials by combining a flexible circuit substrate with a rigidity reinforcing structure. This composite construction allows the substrate to maintain overall flexibility for portability while the reinforcing structure provides local rigidity to prevent bending damage to electrical connections.
2Weight of moving object
If the circuit substrate is made thin and lightweight for portable devices, then the weight and size are reduced, but the structural strength and surface flatness deteriorate
Solution Approach 1:
The rigidity reinforcing structure is strategically placed only in regions requiring support (where contacts are located), rather than making the entire substrate thick. This localized approach adds minimal weight while providing sufficient structural strength and surface flatness where needed.
Solution Approach 2:
The substrate structure is segmented into flexible regions and reinforced regions. The rigidity reinforcing structure is divided into multiple discrete elements positioned at specific locations, allowing the substrate to remain thin and lightweight overall while providing targeted structural support.
3Volume of moving object
If the circuit substrate is made thin for portable design, then the size is reduced, but the surface flatness and structural stability worsen
Solution Approach 1:
The rigidity reinforcing structure provides localized support to maintain surface flatness in critical areas (where contacts are located) without increasing the overall substrate thickness. This allows the substrate to remain thin for portable design while maintaining stability where electrical connections are made.
Data Source
AI summary
A portable electronic device and an image-capturing module thereof are provided. The image-capturing module includes a circuit substrate, an image sensing chip, a rigidity reinforcing structure, and a lens assembly. The circuit substrate has a plurality of conductive substrate contacts. The image sensing chip is disposed on the circuit substrate and electrically connected to the circuit substrate. The image sensing chip includes an image sensing region, and a plurality of conductive chip contacts respectively and electrically connected to the conductive substrate contacts. The rigidity reinforcing structure is disposed on the circuit substrate. The lens assembly includes a lens holder and a lens structure disposed on the lens holder, and the lens structure corresponds to the image sensing region. A perpendicular projection of each of the conductive substrate contacts and a perpendicular projection of each of the conductive chip contacts can be shown on the rigidity reinforcing structure.