Testing environment for cryogenic chamber
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Solution Overview
Problem
Cryogenic cooling systems face challenges in minimizing vibration, especially in ultra-high vacuum environments where precise temperature control and low vibration are crucial for experiments like quantum computing, MRI, and MEG applications.
Innovation Solution
A cryogenic cooling system with a closed circuit helium cooling system and a thermal braiding system that includes an inner cooling ring and an outer ring, along with low thermal conductivity legs and a thermal shield, to maintain the experimental payload at a cryogenic temperature while reducing vibration through a vibration gap between the cryocooler and the payload.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cryocooler is used to cool the experimental payload to cryogenic temperatures, then the temperature control is improved, but vibration is generated that interferes with precise experiments
Solution Approach 1:
The patent introduces a vibration isolation platform as an intermediary between the cryocooler and the experimental payload. This platform absorbs and isolates vibrations generated by the cryocooler, preventing them from reaching the experimental apparatus while still allowing thermal conduction for cooling. The platform acts as a mediator that separates the harmful mechanical vibrations from the useful thermal cooling function.
Solution Approach 2:
The system is divided into distinct functional segments: the cryocooler unit, the vibration isolation platform, and the experimental payload mounted on the platform. This segmentation allows each component to perform its specific function independently - the cryocooler generates cooling, the platform isolates vibrations, and the payload receives cooled operation without vibration interference.
2Use of energy by moving object
If thermal conduction paths are used to cool the payload, then cooling efficiency is improved, but heat leakage to the payload increases from the environment
Solution Approach 1:
The patent transitions from one-dimensional thermal conduction (direct contact paths) to two-dimensional thermal management by introducing radiative cooling surfaces. The inner and outer cooling rings create a multi-layer thermal shield system that manages heat transfer through multiple dimensions - conductive paths for active cooling and radiative surfaces for passive heat rejection to the cryogenic environment.
Solution Approach 2:
The system changes the thermal parameters of the environment by maintaining a cryogenic temperature region around the payload. By cooling the surrounding chamber to cryogenic temperatures, the temperature gradient between the environment and the payload is reduced, thereby minimizing heat leakage while maintaining efficient thermal conduction paths for active cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains the experimental payload at cryogenic temperatures with reduced vibration, enabling precise control for applications such as quantum computing, MRI, and MEG, by using a closed circuit helium cooling system and thermal braiding to manage heat transfer and minimize vibrations.
Implementation Method 1
a closed circuit helium cooling system configured to reduce vibration during operation... The cryogenic system conducts heats away from the experimental payload
Implementation Method 2
an inner cooling ring cooled via an internal braiding system... an outer ring in communication with the inner cooling ring
Implementation Method 3
a plurality of legs operably coupled to the cryogenic chamber... The legs are characterized by a low thermal conductivity
Implementation Method 4
The outer ring is configured to absorb heat from the experimental payload and the outer ring defines a second temperature that is greater than the first temperature
Data Source
AI summary
An experimental payload and cryogenic system are provided. An experimental payload including a cryogenic chamber is provided. The cryogenic chamber includes an action chamber configured to be cryogenically cooled to an action temperature. The cryogenic chamber also includes an inner cooling ring cooled via an internal braiding system. The inner cooling ring is configured to operate at a first temperature. The cryogenic chamber further includes an outer ring in communication with the inner cooling ring. The outer ring is configured to absorb heat from the experimental payload. The outer ring defines a second temperature that is greater than the first temperature. The cryogenic chamber also includes a plurality of legs operably coupled to the cryogenic chamber at a top end of each leg. The legs are characterized by a low thermal conductivity and the experimental payload is configured to be attached to a base of a cryocooler.