Cryogenic refrigeration for low temperature devices
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Solution Overview
Problem
Traditional cooling methods for low and extremely low temperature quantum devices are bulky, expensive, and unreliable, posing challenges in maintaining the required cryogenic temperatures for efficient operation.
Innovation Solution
The development of an active cooling structure using Superconductor-Insulator-Normal Metal (SIN) tunnel structures, where a non-superconducting metal layer and a superconducting layer are separated by an insulator, allowing for efficient heat transfer through the formation of NIS tunnel structures, which are integrated with quantum processors to maintain low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional vapor compression coolers are used to maintain low temperatures for quantum devices, then cooling function is provided, but the system becomes bulky, expensive, and unreliable
Solution Approach 1:
The patent replaces traditional mechanical vapor compression cooling systems with a semiconductor-based thermoelectric cooling device. This substitution eliminates the need for bulky mechanical components, moving parts, and complex refrigeration cycles, thereby improving reliability while reducing device complexity. The thermoelectric device directly converts electrical energy to thermal gradient using the Peltier effect, providing a solid-state solution suitable for cryogenic quantum computing applications.
2Temperature
If traditional vapor compression coolers are used for cooling quantum devices, then temperature control is achieved, but the system becomes bulky and expensive
Solution Approach 1:
The patent replaces mechanical vapor compression coolers with a semiconductor thermoelectric cooling device that uses solid-state physics principles. This eliminates bulky mechanical components, refrigerants, and complex control systems while maintaining effective temperature control at cryogenic levels required for quantum device operation.
3Reliability
If traditional vapor compression coolers are used to maintain cryogenic temperatures, then cooling is provided, but the system becomes expensive and not completely reliable
Solution Approach 1:
The patent replaces expensive mechanical vapor compression systems with solid-state thermoelectric cooling devices. This substitution reduces system cost by eliminating complex mechanical components, seals, refrigerants, and maintenance requirements while improving reliability through solid-state construction with no moving parts. The thermoelectric device provides efficient cooling at cryogenic temperatures suitable for quantum computing applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a reliable and efficient means to maintain low and extremely low temperatures, reducing the need for bulky cooling structures and improving the overall reliability of quantum devices, enabling effective operation of quantum computing systems.
Implementation Method 1
forming an array of Superconductor-Insulator-Normal Metal (NIS) tunnel structures between a non-conducting layer and a superconducting layer
Implementation Method 2
The superconductor layer may comprise a plurality of superconducting traces running in a second direction
Data Source
AI summary
A method for fabricating an active cooling structure, comprising forming an array of Superconductor-Insulator-Normal Metal (NIS) tunnel structures between a non-conducting layer and a superconducting layer. The non-superconducting layer may comprise a plurality of non-superconducting traces running in a first direction. The superconductor layer may comprise a plurality of superconducting traces running in a second direction.