Cryostat Socket Frame and Cover Design for Ion Trap Heat Removal
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Solution Overview
Problem
Ion trap devices for quantum computing in cryogenic environments face challenges with increased size and power dissipation, requiring improved heat management and secure, efficient installation methods while minimizing exposure to electrostatic potentials and contamination.
Innovation Solution
A cryostat socket design with a frame and cover configuration that thermally couples the ion trap device to a heat removal surface, spreading heat from the inner to the outer region of the device carrier and providing compressive force for efficient heat removal, along with a spring pin insert for reliable electrical contact and precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the ion trap device is increased in size to control more ions, then the number of controllable ions increases, but the heat dissipation requirement increases and device complexity increases
Solution Approach 1:
The device carrier is divided into functionally distinct regions: a laterally inner region for mounting the ion trap device and a laterally outer region for heat dissipation. This segmentation allows the system to accommodate larger ion trap devices with more electrodes while dedicating specific areas for thermal management, thereby enabling control of more ions without compromising heat dissipation capabilities.
Solution Approach 2:
The laterally outer region of the device carrier acts as an intermediary heat dissipation structure between the ion trap device and the cryostat environment. This intermediary region provides an extended thermal pathway that efficiently conducts heat away from the increasing number of electrodes and trap components, enabling scalable ion trap configurations.
2Quantity of substance
If the ion trap device is increased in size with more electrodes, then the number of controllable ions increases, but the device complexity increases
Solution Approach 1:
The device carrier integrates multiple functions into a single component: it provides mechanical support for the ion trap device, establishes thermal coupling to the cryostat, and enables electrical connections. This merging of functions into the device carrier structure simplifies the overall system architecture despite the increased number of electrodes, as the carrier serves as a unified platform for mounting, cooling, and electrical interfacing.
Solution Approach 2:
The device carrier is designed as a multi-functional component that simultaneously performs mechanical support, thermal management, and electrical connection functions. This universal design allows the same structure to handle increasingly complex ion trap configurations with more electrodes without requiring additional specialized components, thereby managing device complexity while enabling control of more ions.
3Reliability
If a secure mounting method is used to hold the ion trap device, then the reliability of installation increases, but the ease of operation for device changes decreases
Solution Approach 1:
The mounting system employs a spring pin insert that provides dynamic, resilient electrical and mechanical contact between the device carrier and the socket. The spring mechanism maintains reliable contact pressure while allowing for easy insertion and removal of device carriers, thus achieving both secure mounting for reliable operation and simplicity for rapid device changes during development iterations.
Solution Approach 2:
The spring pin insert automatically maintains optimal contact pressure through its elastic properties, requiring no manual adjustment or additional fastening mechanisms. This self-regulating contact system ensures reliable electrical connections while enabling operators to quickly swap device carriers by simply inserting or removing them from the socket, combining installation reliability with operational ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat removal efficiency, reduces exposure to electrostatic potentials, and facilitates safe and fast ion trap device changes, improving the performance and scalability of ion trap devices in cryogenic environments.
Implementation Method 1
The device carrier is configured to spread heat produced by the ion trap device from the laterally inner region to the laterally outer region
Implementation Method 2
a cover configured to exert a compressive force on the front side of the device carrier when assembled with the frame, by which the rear side of the device carrier is thermally coupled to the heat removal surface
Data Source
AI summary
A cryostat socket for holding an ion trap device mounted on a substrate in a cryostat includes a frame having a heat removal surface configured to be thermally coupled to a laterally outer region of the device carrier. The cryostat socket further includes a cover configured to exert a compressive force on the front side of the device carrier when assembled with the frame, by which the rear side of the device carrier is thermally coupled to the heat removal surface.