Crystal Oscillator Thermal Layout for Accurate Quartz Temperature Sensing
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Solution Overview
Problem
Conventional crystal oscillators face challenges in accurately measuring temperature near the quartz crystal piece due to poor heat transfer properties of materials between the temperature sensor and the quartz crystal, leading to errors in frequency temperature compensation and deteriorated oscillation frequency accuracy.
Innovation Solution
A crystal oscillator design that includes a semiconductor chip with a first bump connected to the oscillator circuit and a temperature sensor bonded to it, allowing for improved thermal proximity and accuracy in temperature measurement, along with a heater device for temperature control, and a heat insulating film to minimize external heat influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple protective coat materials (SiO2, SiN, polyimide) are disposed between the temperature sensor device and the quartz crystal piece, then the protective function is improved, but the heat transfer property deteriorates and the heat transfer model becomes complicated
Solution Approach 1:
The patent extracts and removes the multiple protective coat materials (SiO2, SiN, polyimide) from between the temperature sensor device and the quartz crystal piece. By taking out these interfering materials, the patent achieves direct thermal contact between the sensor and crystal, eliminating the complicated heat transfer model and improving temperature detection accuracy while maintaining protective functions through alternative means.
2Reliability
If the temperature sensor device is thermally connected to the quartz crystal piece through multiple protective coat materials, then the protective function is improved, but the heat transfer efficiency deteriorates
Solution Approach 1:
The patent removes the multiple protective coat materials that were blocking thermal contact. By extracting these materials, the patent establishes direct thermal connection between the temperature sensor device and the quartz crystal piece, significantly improving heat transfer efficiency and enabling accurate temperature measurement for frequency compensation.
3Reliability
If a conventional package structure with multiple protective layers is used, then the protective function is improved, but the device complexity increases and manufacturing difficulty increases
Solution Approach 1:
The patent extracts and eliminates the complex multi-layer protective coat structure (SiO2, SiN, polyimide) from the thermal path. By removing these layers, the patent simplifies the heat transfer model to a straightforward conduction path, reducing device complexity while maintaining protective functions through the package structure itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the accuracy of temperature measurement and frequency stability by improving thermal connection between the quartz crystal, temperature sensor, and heater, resulting in improved frequency accuracy and reduced external heat interference.
Implementation Method 1
The first bump is connected to the oscillator circuit and disposed on a surface of the semiconductor chip facing the quartz crystal piece. The temperature sensor is bonded to the first bump.
Implementation Method 2
The temperature sensor is bonded to the first bump... the temperature sensor device 840 is thermally connected to the quartz crystal piece 820... to measure a temperature near the quartz crystal piece with accuracy as high as possible
Implementation Method 3
an Oven Controlled Crystal Oscillator (OCXO) including the quartz crystal piece, the temperature sensor, a heater circuit, and a temperature control circuit
Data Source
AI summary
A crystal oscillator includes a quartz crystal piece, a semiconductor chip, and a temperature sensor. The semiconductor chip includes an oscillator circuit to cause the quartz crystal piece to oscillate and a first bump. The first bump is connected to the oscillator circuit and disposed on a surface of the semiconductor chip facing the quartz crystal piece. The temperature sensor is bonded to the first bump.