Cu-Ni-Sn Sinter Paste for High-Temperature Interconnects
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Solution Overview
Problem
Conventional interconnect materials and processing techniques fail to provide reliable high-temperature operation and durability for electronic systems due to thermo-mechanical stresses, low melting temperatures, and regulatory restrictions, especially in harsh environments like aerospace and automotive applications.
Innovation Solution
The development of Cu—Ni—Sn-based transient liquid phase sinter pastes that form intermetallic compounds at relatively low processing temperatures, resulting in high-strength, void-free sinter joints with intact high melting temperature particles, suitable for extreme temperature conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interconnect materials are used, then ease of manufacture is maintained, but reliability deteriorates under high temperature conditions
Solution Approach 1:
The patent changes the material parameters by using intermetallic compounds with high melting points (e.g., Ni3Al, Ni3Ti, Co3Ti) instead of conventional low-melting-point solders. This parameter change enables the interconnect to maintain structural integrity at elevated temperatures while still being manufacturable through modified sintering processes.
Solution Approach 2:
The patent employs composite interconnect structures combining multiple materials with complementary properties. For example, Ni-based intermetallics provide high-temperature strength while Cu layers provide electrical conductivity. This composite approach achieves both high-temperature reliability and manufacturability by leveraging the strengths of different materials.
2Temperature
If high melting temperature materials are used, then temperature resistance is improved, but processing difficulty increases
Solution Approach 1:
The patent applies preliminary actions by pre-forming green compacted shapes of intermetallic compounds before final sintering. This allows the complex high-melting-point materials to be positioned and shaped in advance, reducing the difficulty of the actual sintering process while maintaining their high-temperature performance characteristics.
Solution Approach 2:
The patent uses intermediary materials and processes such as organic binders and fluxes that facilitate the sintering of high-melting-point intermetallic compounds at lower temperatures. These intermediaries enable manufacturing at reduced temperatures while still achieving the desired high-temperature operational properties in the final product.
3Duration of action of stationary object
If conventional solder materials are used, then ease of operation is maintained, but durability deteriorates under thermal stress
Solution Approach 1:
The patent changes the thermal parameters of the interconnect material by selecting intermetallic compounds with melting points significantly higher than conventional solders. This parameter change extends the service life under thermal loading by preventing softening and degradation at elevated temperatures, while the application process remains relatively simple through paste formulation.
4Strength
If high strength interconnects are formed, then mechanical strength is improved, but voiding increases
Solution Approach 1:
The patent initially creates a porous green compacted structure that is then densified through sintering. This controlled porosity approach allows the formation of strong intermetallic bonds during sintering while minimizing residual voids. The porous precursor structure facilitates complete reaction and densification, achieving both high strength and low void content.
Solution Approach 2:
The patent utilizes phase transitions during the sintering process, where organic binders decompose and volatiles are removed, creating temporary porosity that facilitates material flow and densification. This controlled phase transition enables the formation of dense, void-free strong joints by allowing complete consolidation during the sintering cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sinter pastes enable the formation of reliable, high-strength interconnects that maintain integrity up to 600°C or more, with superior mechanical properties and reduced voiding, overcoming the limitations of conventional solder technologies.
Implementation Method 1
the low melting temperature metal particles melt and infiltrate spaces between the high melting temperature particles
Implementation Method 2
infiltrate spaces between the high melting temperature particles, thereby forming a sintered joint comprising intermetallic compounds
Implementation Method 3
initiating a sintering process at a process temperature so that the low melting temperature metal particles melt and infiltrate spaces between the high melting temperature particles, thereby forming a sintered joint
Implementation Method 4
forming a sintered joint comprising intermetallic compounds
Data Source
AI summary
The present invention relates to transient liquid phase sinter pastes for electronic interconnects, and sinter paste application and processing methods.