Curable Resin Composition for High-Frequency Applications
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Solution Overview
Problem
Conventional curable resins containing vinyl groups, such as poly(vinylbenzyl) ethers, fail to provide electric insulating materials with both low dielectric loss tangent and high heat resistance required for high-frequency applications and lead-free soldering processes.
Innovation Solution
A curable resin composition comprising a methacryloyloxy group-containing compound and an aromatic vinyl group-containing compound, which undergoes a curing reaction to produce a cured product with enhanced heat resistance and low dielectric properties, achieved by specific structural formulations and reaction conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vinylbenzyl ether curable resins are used, then the resin can be cured and form insulating materials, but the dielectric loss tangent is too high for high-frequency applications
Solution Approach 1:
The invention changes the chemical structure parameters of the curable resin by introducing specific aromatic rings (naphthalene, anthracene, phenanthrene) and controlling the vinyl group content (0.5-5 mmol/g), thereby reducing the dielectric loss tangent to enable high-frequency application suitability
Solution Approach 2:
The invention creates a composite curable resin system combining vinylbenzyl ether structures with specific aromatic hydrocarbon frameworks, achieving both low dielectric loss tangent and adequate heat resistance through structural composition optimization
2Temperature
If divinylbenzyl ether of bisphenol is used to improve heat resistance, then the resin can withstand higher temperatures, but the dielectric properties are insufficient for high-frequency use
Solution Approach 1:
The invention modifies the molecular structure by incorporating naphthalene, anthracene, or phenanthrene rings and controlling vinyl group density, achieving a balance where heat resistance is maintained while dielectric properties are improved for high-frequency applications
Solution Approach 2:
The invention introduces specific aromatic ring structures at strategic positions in the molecule to locally enhance dielectric properties while maintaining the overall heat resistance through the backbone structure
3Reliability
If poly(vinylbenzyl) ether with specific structures is used to improve induction properties, then some dielectric improvement is achieved, but heat resistance remains insufficient for lead-free soldering
Solution Approach 1:
The invention creates a composite molecular structure combining vinylbenzyl ether functionality with rigid aromatic hydrocarbon frameworks (naphthalene, anthracene, phenanthrene), achieving both low dielectric loss tangent and sufficient heat resistance for lead-free soldering processes
Solution Approach 2:
The invention optimizes the vinyl group content parameter (0.5-5 mmol/g) and introduces specific aromatic ring structures, simultaneously improving dielectric properties while enhancing heat resistance to withstand lead-free soldering temperatures
4Ease of manufacture
If conventional curable resins are used, then the material can be processed and cured, but the glass transition temperature is too low for lead-free soldering requirements
Solution Approach 1:
The invention changes the molecular structure by incorporating rigid aromatic rings (naphthalene, anthracene, phenanthrene) and optimizing vinyl group content, thereby increasing the glass transition temperature to meet lead-free soldering requirements while maintaining processability
Solution Approach 2:
The invention introduces rigid aromatic ring structures at specific positions in the molecule to locally enhance thermal stability and increase glass transition temperature, enabling lead-free soldering compatibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting cured product exhibits improved heat resistance and dielectric properties, meeting the demands for high-frequency applications and lead-free soldering, with a dielectric loss tangent of 2.0×10−3 or less and a glass transition temperature of 150°C or higher.
Implementation Method 1
a curable resin composition containing a curable resin (A) having a structure represented by General Formula (1) below and a curable resin (B1) having a structure represented by General Formula (2-1) below and/or a curable compound (B2) represented by General Formula (2-2) below... a cured product obtained by subjecting the curable resin composition to a curing reaction
Data Source
AI summary
An object is to provide a curable resin composition that can provide its cured product with excellent heat resistance (a high glass transition temperature) and dielectric properties (low dielectric properties) and the cured product. Specifically, provided is a curable resin composition containing a curable resin (A) having a structure represented by General Formula (1) below and a curable resin (B1) having a structure represented by General Formula (2-1) below and/or a curable compound (B2) represented by General Formula (2-2) below:in General Formula (1) above, the details of the substituents and the number of the substituents are as described in the present specification.in General Formulae (2-1) and (2-2) above, the details of the substituents and the number of the substituents are as described in the present specification.