Electrical Equipment TRIZ Cases

Cycloaliphatic polyamide molding compound maintains adhesion to metal elements, preventing degradation in salt solutions under voltage.

Bulky imidazole substituents suppress catalytic activity during storage while enabling rapid low-temperature curing of cyanate resins.

Variable adhesive layer thickness and elastic modulus in strain accumulation areas prevent peeling while maintaining bonding reliability.

A resin composition uses a specific compound and vinyl-containing elastomer to achieve strong copper adhesion.

Compression flattens the graphene matrix in a metal foam substrate, resolving brittleness and restoring thermal conductivity.

A modified polyphenylene oxide resin blends bismaleimide and benzoxazine to enhance thermosetting properties.

A resin composition uses unsaturated polyphenylene ether and a low pH compound to form prepregs.

Silane coupling agents join hollow and non-hollow fillers to resolve the contradiction between dielectric stability and copper foil peeling strength.

Benzotriazole-based adhesive suppresses ion migration from thinned metal wires, preventing circuit disconnection and maintaining stable electrical resistance.

A 2.5D glass touch screen cover plate assembles with a liquid crystal display module to form an integrated three-in-one unit.

A multi-layer insulation structure with metallic facing and nonwoven layers stabilizes battery temperature.

A backplate with a projection structure increases contact area between the plastic frame and metal substrate.

Electroplating germanium into tin coatings prevents whisker growth without eliminating pure tin usage.

Stable polymer solution enables self-crosslinking resin prepregs.

A curable resin composition combines methacryloyloxy and aromatic vinyl groups to form a cross-linked polymer network.

Diisoalkenylarene-divinylarene copolymers maintain low dielectric constants while providing thermal stability for electronic laminates.

Segmenting the coating into an adhesive base and a smooth cover layer resolves the trade-off between adhesion strength and vacuum pickup reliability.

Parallel conductive wires attached to insulating carrier films electrically interconnect photovoltaic cells in series.

Varying distances between the reflective filler and solar cells optimize reflection angles, increasing re-incident light and output characteristics.

Maleimide resin composition with high thermal conductivity ceramic filler enhances heat dissipation.

Cyanate ester resin with controlled filler ratios enhances thermal conductivity and moldability.

Strontium titanate fillers in a bismaleimide matrix raise the dielectric constant to meet 5G insulation needs without sacrificing heat resistance.

Optimizing metal nanowire anisotropy resolves the trade-off between flexibility and optical performance in roll-to-roll manufactured touch sensors.

A vehicle head-up display uses a windshield film with identification features and an infrared calibration array to project virtual images.

Plasma etching forms inclined micropores on metal to embed resin, replacing harsh chemical processes that cause environmental harm and processing difficulty.

A laminate uses a base sheet with 0.01 to 10 GPa Young's modulus and a metal particle layer for reliable semiconductor chip transfer.

Optimizing PPE molecular weight balances dielectric properties with sufficient melt flow, preventing voids in multilayer printed wiring boards.

Composite foam substrate doped with carbon nanotubes creates a thermal network, resolving the trade-off between impact resistance and heat conductivity.

A low-dielectric rubber resin material combines liquid rubber with polyphenylene ether and bismaleimide resins.

Controlled oxidation temperature creates a nickel surface treatment layer on electrodeposited copper foil.