Resin Composition for Printed Wiring Boards
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Solution Overview
Problem
Thermosetting resin compositions highly filled with inorganic fillers improve thermal conductivity but compromise moldability and mechanical drillability, leading to issues like cracks, voids, and drill bit wear in printed wiring boards.
Innovation Solution
A resin composition combining cyanate ester compounds, epoxy resins, and specific inorganic fillers with controlled particle diameter ratios, along with a molybdenum compound, to enhance thermal conductivity while maintaining moldability and mechanical drillability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermosetting resin composition is highly filled with inorganic filler to improve thermal conductivity, then thermal conductivity is improved, but moldability deteriorates and cracks and voids occur between resin and inorganic filler
Solution Approach 1:
The patent applies parameter changes by optimizing the particle diameter distribution of inorganic fillers, specifically controlling the D10, D50, and D90 values to specific ranges and maintaining a D10/D50 ratio of 0.25 or more. This parameter optimization allows high filler content (70-85 wt%) to be achieved while maintaining adequate moldability and preventing defects
Solution Approach 2:
The patent uses composite materials by combining multiple types of inorganic fillers with different particle size distributions (first inorganic filler with D50 of 2-10 μm and second inorganic filler with D50 of 0.5-2 μm) to create a synergistic effect that improves both thermal conductivity and processability simultaneously
2Temperature
If a printed wiring board is highly filled with inorganic filler to improve heat dissipation, then thermal conductivity is improved, but mechanical drillability deteriorates causing significant wear and breakage of drill bits
Solution Approach 1:
The patent applies parameter changes by controlling the particle diameter distribution parameters (D10, D50, D90) and the D10/D50 ratio of inorganic fillers, which optimizes the balance between heat dissipation performance and mechanical drillability, reducing drill bit wear and breakage
Solution Approach 2:
The patent applies local quality by creating a specific particle size distribution where smaller particles (D10) are controlled to be sufficiently large relative to the median size (D50), providing local regions that are easier to drill through while maintaining overall thermal conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent heat dissipation, moldability, and mechanical drillability, with improved glass transition temperature and peel strength, suitable for high-density printed wiring boards.
Implementation Method 1
a thermally conductive resin composition is proposed in which 80 to 95% by weight of a mixed filler (inorganic filler) having a predetermined particle diameter distribution is blended with a thermosetting resin to attain the thermal conductivity of the cured product to 3 to 10 W/mK
Data Source
AI summary
The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.