DIAEA-DVA Copolymer Dielectric Constant Thermal Stability
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Solution Overview
Problem
Current high heat-resistant materials for electronic components, such as dielectric layers and printed circuit boards, face challenges in achieving optimal thermal stability, electrical properties, and processability while maintaining low dielectric constants and dissipation factors.
Innovation Solution
A thermosetting composition comprising a copolymer of diisoalkenylarene and divinylarene, specifically m-divinylbenzene and p-divinylbenzene, with a mole ratio of 15:1 to 1:15, which exhibits a Gel Content of >90% and dielectric constant and dissipation factor of <2.8 and <0.002, respectively, after curing at temperatures above 120°C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cross-linkable (co)polymers with reactive functional groups are used to achieve high heat resistance and high cross-linking density, then thermal stability is improved, but dielectric constant and dissipation factor may increase
Solution Approach 1:
The patent changes the chemical structure parameters of the polymer by using diisoalkenylarene monomers with specific alkyl substituents (methyl, ethyl, propyl, butyl groups) at controlled ratios. This modifies the polymer's physical and electrical properties to achieve low dielectric constant while maintaining thermal stability through cross-linking
Solution Approach 2:
The patent creates a composite system by combining diisoalkenylarene (DIAEA) with divinylarene (DVA) in a specific mole ratio (15:1 to 1:15). This composite copolymer structure synergistically provides both low dielectric properties from DIAEA and high cross-linking density from DVA, resolving the contradiction between thermal stability and electrical properties
2Temperature
If cross-linking density is increased to improve heat resistance, then thermal stability is improved, but processability and workability deteriorate
Solution Approach 1:
The patent applies partial cross-linking by controlling the DVA content at 15-95 wt% in the copolymer composition. This partial action provides sufficient heat resistance while leaving enough uncross-linked polymer chains to maintain processability and workability during fabrication
Solution Approach 2:
The patent optimizes the mole ratio of DIAEA to DVA (15:1 to 1:15) to control the balance between cross-linking density and processability. This parameter optimization ensures the material can be processed at elevated temperatures while achieving the desired heat resistance
3Quantity of substance
If dielectric constant is reduced for better electrical performance, then electrical properties are improved, but thermal stability may deteriorate
Solution Approach 1:
The patent creates a composite copolymer structure where DIAEA (providing low dielectric constant through its alkyl-substituted aromatic structure) is combined with DVA (providing thermal stability through high cross-linking density). The synergistic effect of this composite resolves the contradiction between electrical and thermal properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides enhanced thermal stability, excellent processability, and improved electrical properties, making it suitable for use in metal-clad laminates for electronic applications.
Implementation Method 1
Cross-linkable (co)polymer compositions offer the advantage of high heat resistance alongside other sought-after properties... These (co)polymers can be designed with reactive functional groups like vinyl, epoxy, etc., facilitating increased cross-linking density upon curing
Implementation Method 2
The thermosetting composition after curing at a temperature of greater than 120° C. is characterized as having: a Gel Content of >90%
Data Source
AI summary
The disclosure relates to a thermosetting composition comprising a copolymer of (a) a diisoalkenylarene (DIAEA), and (b) a divinylarene (DVA) comprising m-DVB, p-DVB, m-EVB, p-EVB, and mixtures thereof. A mole ratio of DIAEA to DVA is from 15:1 to 1:15. The thermosetting composition after curing at a temperature of ≥120° C. is characterized as having: a Gel Content of >90%, a Dk of <2.6 and Df of <0.002, both measured at 10 GHz, according to ASTM D2520. The thermosetting composition provides improved thermal stability at high temperature and excellent processability when used electronic applications as metal-clad laminates and build-up films.