Doped Foam Buffer Structure for OLED Heat Dissipation
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Solution Overview
Problem
The heat conductivity of the super clean foam (SCF) layer in OLED display apparatuses is poor due to its impact resistance role, which adversely affects the overall performance.
Innovation Solution
A buffer structure with a substrate layer doped with electrically and thermally conductive materials like carbon fiber, carbon nanotubes, graphene, and titanium carbide, forming a heat conduction network structure, combined with a high polymer material and copper powder, to enhance heat dissipation and impact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a multilayer structure of foam, graphite and copper foil is used for the SCF layer, then impact resistance is improved, but heat conductivity deteriorates
Solution Approach 1:
The patent uses a composite material consisting of a foam substrate doped with electrically and thermally conductive materials (carbon fiber, carbon nanotubes, graphene, or titanium carbide). This composite structure combines the impact resistance of foam with the heat conduction capabilities of the dopant materials, achieving both mechanical strength and thermal conductivity in a single integrated layer rather than requiring multiple separate layers.
Solution Approach 2:
The patent employs a foam substrate with a porous structure that is doped with conductive materials. The porous foam provides impact resistance and structural integrity, while the dopant materials distributed within the pores establish heat conduction pathways. This approach maintains the beneficial mechanical properties of foam while introducing thermal conductivity through the conductive dopants.
2Strength
If foam is used in the SCF layer for impact resistance, then mechanical strength is improved, but heat conductivity deteriorates
Solution Approach 1:
The foam is transformed into a composite material by doping it with electrically and thermally conductive materials. The foam matrix provides mechanical strength and impact resistance, while the dispersed conductive particles (carbon fiber, carbon nanotubes, graphene, or titanium carbide) create thermal conduction networks throughout the foam structure, enabling heat dissipation while maintaining mechanical integrity.
Solution Approach 2:
The conductive materials are distributed locally throughout the foam structure at specific concentrations (weight ratios of 5-10% conductive material to 90-95% high polymer material). This local doping approach ensures that heat conduction pathways are established at critical locations without compromising the overall foam structure and its impact resistance properties.
3Strength
If the SCF layer adopts a multilayer structure, then impact resistance is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of multiple layers (foam for impact resistance, graphite for electrical conductivity, and copper foil for heat conduction) into a single integrated SCF layer. By doping the foam substrate with electrically and thermally conductive materials, the invention combines mechanical protection, electrical shielding, and thermal management functions in one component, thereby reducing device complexity while maintaining or improving performance.
Solution Approach 2:
The doped foam SCF layer serves multiple functions simultaneously: it provides impact resistance through the foam structure, electrical shielding through the conductive dopants, and heat conduction through the thermal pathways established by the same dopant materials. This multi-functionality eliminates the need for separate dedicated layers for each function, simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer structure improves heat dissipation and electromagnetic shielding, reduces the overall thickness of the display apparatus, and simplifies the production process while maintaining impact resistance.
Implementation Method 1
The electrically and thermally conductive material is distributed in a whole-layer structure of the substrate layer. The electrically and thermally conductive material forms a heat conduction network structure in the substrate layer.
Implementation Method 2
loading the composite material into an extruder for melt blending, and inletting a supercritical fluid; and forming the buffer structure by extruding, foaming, molding by the extruder.
Data Source
AI summary
A buffer structure, a preparation method for the buffer structure, and a display apparatus are provided. The buffer structure includes a substrate layer. A plurality of microporous structures are distributed in the substrate layer. The substrate layer is doped with electrically and thermally conductive materials. The electrically and thermally conductive material is distributed in the whole-layer structure of the substrate layer. The electrically and thermally conductive materials forms a heat conducting network structure in the substrate layer.