Laminate with Controlled Young's Modulus for Semiconductor Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing laminates used for adhering semiconductor chips to lead frames often fail to ensure sufficient transfer of the film, leading to inadequate adhesion between the chip and the frame.
Innovation Solution
A laminate comprising a base sheet with a Young's modulus of 0.01 to 10 GPa, measured using nano-indentation, and a metal particle-containing layer that is releasable and sinterable, allowing for effective transfer and adhesion to the chip and frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional pasty composition is used for adhering semiconductor chip to lead frame, then the adhesion function is provided, but the film transfer to adherend is insufficient
Solution Approach 1:
The patent applies parameter changes by controlling the Young's modulus of the base sheet within a specific range (0.01 to 10 GPa). This parameter optimization enables the base sheet to be sufficiently soft to allow film transfer to the adherend while maintaining structural integrity. The specific Young's modulus range resolves the contradiction by ensuring both adequate film transfer (improving manufacturing precision) and reliable adhesion (improving reliability).
Solution Approach 2:
The patent employs composite materials by combining a base sheet with controlled Young's modulus and a metal particle-containing layer. This composite structure allows the base sheet to provide mechanical support and film transfer capability, while the metal particle layer provides adhesion function. The composite approach resolves the contradiction by integrating materials with complementary properties for both film transfer and reliable adhesion.
2Ease of operation
If the base sheet is made softer to improve film transfer, then transferability is improved, but structural strength is reduced
Solution Approach 1:
The patent resolves this contradiction through parameter changes by precisely controlling the Young's modulus within the range of 0.01 to 10 GPa. This parameter optimization ensures the base sheet is soft enough for effective film transfer (improving ease of operation) while maintaining sufficient structural strength (preventing excessive softening). The specific parameter range balances both requirements.
Solution Approach 2:
The patent uses composite materials to resolve the contradiction between softness for transferability and strength for structural integrity. The base sheet with controlled Young's modulus provides the necessary softness for film transfer, while the metal particle-containing layer contributes to overall structural strength. This composite structure allows simultaneous achievement of ease of operation and strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate ensures sufficient transfer and adhesion of the metal particle-containing layer to the adherend, enhancing the electrical and thermal conductivity while maintaining the shape and reducing material costs.
Implementation Method 1
a Young's modulus at 23 °C of the base sheet, which is obtained by measuring the contact surface using a nano-indentation method, is 0.01 to 10 GPa
Implementation Method 2
the base sheet has a contact surface in contact with the metal particle-containing layer, the metal particle-containing layer is laminated on the base sheet so as to be releasable from the base sheet
Implementation Method 3
a metal particle-containing layer that is laminated on the base sheet and includes metal particles
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The present invention is a laminate including a base sheet and a metal particle-containing layer laminated on the base sheet, and including metal particles. The base sheet has a contact surface in contact with the metal particle-containing layer, and a Young's modulus of the base sheet at 23 °C, which is obtained by measuring the contact surface using a nano-indentation method, is 0.01 to 10 GPa.