Ring-Opened Polymer Solution for PCB Laminates
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Solution Overview
Problem
Conventional printed circuit board resins, such as epoxy resins, offer high thermal and chemical resistance but are fragile and lack impact resistance, while methods to enhance flammability, like using DOPO-based compounds, are energy-consuming and difficult to control uniformly.
Innovation Solution
A stable solution is created through the ring-opening polymerization of an N,O-heterocyclic compound and a DOPO-based compound in an organic solvent, allowing for the preparation of a prepreg and laminate with improved thermal, mechanical, and flammability properties without excessive energy consumption or reaction uniformity issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used to prepare printed circuit board, then thermal resistance and chemical stability are improved, but impact resistance and toughness deteriorate
Solution Approach 1:
The patent uses a composite resin system combining N,O-heterocyclic compound (benzoxazine) with epoxy resin. The N,O-heterocyclic compound provides toughness and impact resistance while the epoxy resin contributes thermal resistance and chemical stability, creating a balanced composite material that resolves the contradiction between these opposing properties.
2Reliability
If N,O-heterocyclic compound is used to enhance flammability resistance, then thermal properties are improved, but flammability resistance remains insufficient
Solution Approach 1:
The patent merges N,O-heterocyclic compound with phosphorus-containing flame retardant (DOPO-based compound) in a single resin system. The N,O-heterocyclic compound provides the thermal properties and structural stability, while the phosphorus-containing compound contributes flammability resistance, achieving both requirements simultaneously through combination.
3Object-affected harmful factors
If DOPO-based compound powder is mixed and cured under high temperature and pressure, then flammability is improved, but energy consumption increases and reaction uniformity control becomes difficult
Solution Approach 1:
The patent changes the physical state parameter of the DOPO-based compound from powder to solution form, and adjusts the curing temperature parameter from high temperature to lower temperature range. This allows the flame retardant to be effectively incorporated while significantly reducing energy consumption and improving reaction uniformity control.
4Object-affected harmful factors
If DOPO-based compound powder is mixed and cured under high temperature and pressure, then flammability is improved, but process complexity and difficulty of controlling reaction uniformity increase
Solution Approach 1:
The patent changes the physical state of the flame retardant from powder to solution, and reduces the curing temperature parameter. This simplifies the manufacturing process by eliminating the need for high-temperature and high-pressure equipment, improves mixing uniformity, and makes the reaction easier to control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable polymer solution that enhances the flammability and mechanical properties of printed circuit board laminates, maintaining stability over time and reducing water absorption, while being energy-efficient and uniformly reactive.
Implementation Method 1
the ring-opening reaction of an N,O-heterocyclic compound and a DOPO-based compound
Implementation Method 2
a novolac laminate can be provided by the cross-linking reaction of the polymer itself
Data Source
AI summary
A stable solution of a ring-opened polymer is provided. The stable solution can be prepared using the following steps:(d) adding an N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution:wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification.(e) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and(f) cooling the polymer solution to obtain the stable solution,wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amount of the DOPO-based compound is about 0.01 wt % to about 50 wt % based on the total weight of the N,O-heterocyclic compound and the DOPO-based compound. The stable solution is useful as a self-crosslinkable resin or a hardener for hardening epoxies.