Resin Composition for 5G High-Dielectric Insulation
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Solution Overview
Problem
The miniaturization of circuit substrates in the 5G/B5G communication era requires resin compositions with high dielectric constants to enhance insulation and reduce power consumption, while maintaining heat resistance, which existing materials fail to adequately address.
Innovation Solution
A resin composition incorporating a bismaleimide resin, benzoxazine resin, naphthalene epoxy resin, strontium titanate or calcium-doped strontium titanate as inorganic fillers, and a siloxane coupling agent, which improves dielectric constant and heat resistance, making it suitable for 5G high-frequency applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin composition with high dielectric constant is developed to increase insulation between circuit lines, then insulation performance is improved, but heat resistance may deteriorate
Solution Approach 1:
The patent uses a composite resin system combining bismaleimide resin, benzoxazine resin, and naphthalene epoxy resin. This multi-component composite achieves high dielectric constant (Dk≥9) while maintaining heat resistance through synergistic effects: bismaleimide provides thermal stability, benzoxazine enhances crosslinking density for both electrical and thermal performance, and naphthalene epoxy contributes to flexibility and adhesion. The composite structure allows simultaneous optimization of insulation and heat resistance properties that single materials cannot achieve.
Solution Approach 2:
The patent modifies the chemical structure parameters of the resin components, specifically using bismaleimide resin with alkyl groups (R1-R4) and core structures (C), and naphthalene epoxy resin with specific naphthalene ring derivatives. These structural parameter changes enable tuning of the dielectric constant while preserving thermal properties. The molecular weight, crosslinking density, and functional group composition are optimized to achieve the desired balance between electrical insulation and thermal resistance.
2Reliability
If inorganic filler is added to increase dielectric constant, then insulation performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates inorganic filler (strontium titanate or calcium-doped strontium titanate) with specific local properties into the resin matrix. The filler particles are distributed throughout the composite to create localized high-dielectric regions that enhance overall insulation performance. This local quality approach allows achieving high dielectric constant without uniformly complicating the entire material structure, maintaining relatively simple manufacturing processes while concentrating the functional enhancement where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively increases the dielectric constant and maintains heat resistance, ensuring it is suitable for high-frequency 5G applications without compromising peel strength or glass transition temperature.
Implementation Method 1
a siloxane coupling agent, which improves dielectric constant and heat resistance
Implementation Method 2
The resin base includes a bismaleimide resin
Implementation Method 3
a naphthalene epoxy resin
Data Source
AI summary
A resin composition and use thereof, wherein the resin composition includes a resin base, an inorganic filler and a siloxane coupling agent. The resin base includes bismaleimide resins, benzoxazine resins, and naphthenic epoxy resins, and the inorganic filler includes strontium titanate or calcium-doped strontium titanate.