Curable Resin Composition with Segmented Fillers

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Solution Overview

Problem

Solvent-free adhesives with reactive silicon groups face issues of high viscosity, making them difficult to apply to wide areas without dripping, and are often expensive when thixotropic properties are added to improve applicability.

Innovation Solution

A curable resin composition combining three types of fillers with specific particle diameters (less than 0.5 μm, 0.5-10 μm, and over 10 μm) with a polyoxypropylene-based polymer, achieving optimal viscosity and workability without the need for organic thixotropic agents.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a filler with large particle diameter is used to reduce viscosity, then viscosity is reduced, but the adhesive drips when scooped up with a trowel, deteriorating workability

Engineering Contradiction:
ImproveviscosityVSAvoidworkability
Core Design Contradiction:
Quantity of substanceVSEase of operation

Solution Approach 1:

The invention segments the filler into three distinct size categories (fine particles <0.5μm, medium particles 0.5-10μm, and coarse particles ≥10μm), where each size fraction performs a specific function: fine particles reduce viscosity, medium particles provide balanced properties, and coarse particles prevent dripping. This segmentation allows the adhesive to simultaneously achieve low viscosity and good workability without using expensive thixotropic agents.

Inventive Principle:
Principle #1Segmentation

2Ease of operation

If colloidal calcium carbonate is added to achieve thixotropic properties, then applicability is improved, but the cost increases significantly

Engineering Contradiction:
ImproveapplicabilityVSAvoidcost
Core Design Contradiction:
Ease of operationVSEase of manufacture

Solution Approach 1:

The invention replaces expensive organic thixotropic agents with inexpensive inorganic fillers of controlled particle sizes. By using common materials like calcium carbonate, silica, or talc in specific particle size distributions, the adhesive achieves thixotropic properties at a fraction of the cost, making the solution economically viable for widespread application.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Object-affected harmful factors

If solvent-free adhesives are used, then environmental problems are reduced, but viscosity increases, causing application difficulties

Engineering Contradiction:
Improveenvironmental impactVSAvoidviscosity
Core Design Contradiction:
Object-affected harmful factorsVSQuantity of substance

Solution Approach 1:

The invention changes the particle size distribution parameter of the filler to control viscosity. By incorporating a specific mix of fine, medium, and coarse particles, the adhesive maintains low viscosity suitable for wide-area application while remaining solvent-free. This parameter adjustment allows the adhesive to overcome the inherent high viscosity of solvent-free formulations without adding harmful solvents.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition ensures excellent workability and mechanical properties, allowing easy application to floor materials without dripping, while maintaining cost-effectiveness by eliminating the need for expensive thixotropic agents.

Implementation Method 1

an adhesive having thixotropic properties obtained by adding approximately 100 parts by weight of colloidal calcium carbonate to a polyoxyalkylene-based polymer having a reactive silicon group is effective as means to solve these problems

Methodology Applied
Scientific EffectThixotropy: Thixotropy

Data Source

PatentUS7820749B2Curable resin composition
Publication Date: 2010.10.26 KANEKA CORP
  • US7820749B2 patent drawing
  • US7820749B2 patent drawing
  • US7820749B2 patent drawing

AI summary

It is an object of the present invention to provide a curable resin composition, having excellent workability (thixotropic properties and applicability) required in applications such as floor adhesives, without causing a decrease in mechanical properties, which contains an organic polymer having a reactive silicon group. The object is attained by a curable resin composition including: an organic polymer (A) having a reactive silicon group; a filler (B) obtained through a combination of three types of filler, namely a filler (B1) having an average particle diameter of less than 0.5 μm, a filler (B2) having an average particle diameter of not less than 0.5 μm to less than 10 μm, and a filler (B3) having an average particle diameter of not less than 10 μm.