Curable Resin Composition for Optical Semiconductor Sealing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Cured products from hydrosilylation of siloxane containing an alkenyl group and Si—H group have low hardness and stickiness issues, and introducing phenyl groups to enhance strength leads to reduced weatherability and heat resistance.

Innovation Solution

A curable resin composition comprising a polyfunctional epoxy compound with three or more epoxy groups and an active hydrogen compound, specifically organopolysiloxanes with certain chemical formulations, to achieve enhanced hardness and resistance to yellowing by heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If hydrosilylation of siloxane containing an alkenyl group and Si-H group is used, then transparency is achieved, but hardness is low and stickiness occurs

Engineering Contradiction:

ImprovetransparencyVSAvoidhardness

Core Design Contradiction:

Illumination intensityVSStrength

Solution Approach 1:

The patent uses a composite curing system combining siloxane hydrosilylation with epoxy resin curing. The composition includes both siloxane components (for transparency) and epoxy resin components (for hardness), creating a composite material that achieves both transparency and high hardness simultaneously.

Inventive Principle:

Principle #40Composite materials

2Strength

If phenyl groups are introduced to enhance strength, then strength is improved, but weatherability and resistance to yellowing by heat are reduced

Engineering Contradiction:

ImprovestrengthVSAvoidresistance to yellowing by heat

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent introduces phenyl groups locally within the polysiloxane structure rather than throughout the entire resin system. Specifically, phenyl-substituted siloxane units are incorporated at controlled levels (0.1-10 mol%) into the polysiloxane backbone, providing localized strength enhancement while maintaining overall heat resistance and weatherability of the bulk material.

Inventive Principle:

Principle #3Local quality

3Strength

If phenyl groups are introduced to enhance strength, then strength is improved, but weatherability is reduced

Engineering Contradiction:

ImprovestrengthVSAvoidweatherability

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides cured products with excellent hardness and heat resistance, suitable for optical semiconductors, and improves the performance of sealing and die bonding materials.

Implementation Method 1

A curable resin composition comprising (A) an epoxy compound having three or more epoxy groups in one molecule and (B) an active hydrogen compound

Methodology Applied

Scientific EffectChemical Bonding: Chemical Bonding

Data Source

PatentUS10208206B2Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element

Publication Date: 2019.02.19 ASAHI KASEI CHEM CORP

AI summary

The present invention relates to a curable resin composition comprising (A) an epoxy compound having three or more epoxy groups in one molecule and (B) an active hydrogen compound.