Current Diffusion Bonding Apparatus with Spring-Loaded Pressurizing Unit
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Solution Overview
Problem
Current diffusion bonding techniques face challenges in accurately bonding thin-wall members due to deformation issues caused by pressure lag and compressive deformation, especially when using electric motor-driven pressurizing systems, which result in inadequate control over deformation to micrometer levels.
Innovation Solution
A current diffusion bonding apparatus employing a dual pressurizing system, where a first pressurizing unit applies high pressure to maintain contact and a second pressurizing unit, based on elastic deformation, maintains constant pressure despite thermal expansion, allowing for precise control of pressure to prevent deformation during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high pressure is applied to prevent gaps between bonding surfaces, then bonding quality is improved, but member deformation increases due to thermal expansion
Solution Approach 1:
The pressurizing force is dynamically adjusted during the bonding process based on real-time pressure sensor feedback. The control unit increases pressurizing force when gaps are detected and decreases it when thermal expansion occurs, optimizing both bonding quality and deformation prevention throughout the heating cycle
Solution Approach 2:
A pressure sensor provides real-time feedback on the pressure applied to members during bonding. The control unit receives this feedback and automatically adjusts the pressurizing force accordingly, creating a closed-loop control system that prevents both gaps and excessive deformation
2Manufacturing precision
If electric motor-driven pressurizing is used for feedback control, then pressing force control is improved, but time lag occurs causing deformation
Solution Approach 1:
The electric motor-driven pressurizing system is replaced with a spring-based mechanical pressurizing system. The spring immediately responds to control signals and adjusts pressurizing force without the inertia and time lag inherent in motor-driven systems, achieving faster response while maintaining control precision
3Shape
If pressurizing force is decreased after displacement detection, then deformation is addressed, but compressive deformation inevitably occurs
Solution Approach 1:
The spring-based pressurizing system is configured to automatically decrease pressurizing force in advance when thermal expansion is detected, before significant deformation occurs. This preliminary adjustment prevents both tensile gaps and compressive deformation by maintaining optimal pressure throughout the heating process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-accuracy bonding of thin-wall members by maintaining consistent pressure, preventing undue deformation and ensuring successful bonding without distortion, even when bonding materials approach their softening temperatures.
Implementation Method 1
a second pressurizing unit which applies a pressure based on an elastic force of an elastic member that elastically deforms according to a displacement in the direction of expansion
Implementation Method 2
heated by passing a pulse current between the electrodes
Implementation Method 3
the bonding is implemented by the close contact of the bonding surfaces resulting from the softening and deformation of the material and the solid phase diffusion phenomenon
Data Source
AI summary
A current diffusion bonding apparatus (1) includes upper and lower electrodes (11, 12), which sandwich members to be bonded (M, M) and which are electrically conductible with the members to be bonded (M, M); a power supply unit (20), which supplies a current to the electrodes (11, 12); and a pressurizing unit (30), which applies a pressure to bonding surfaces S. If a temperature T detected by a temperature sensor (45) is a first set temperature T1 or lower, the pressurizing unit (30) applies a pressure to the bonding surfaces S while restricting the displacement of the members to be bonded (M, M), and if the temperature T exceeds the first set temperature T1, the pressurizing unit (30) applies a pressure based on the elastic force of a spring (35d), which elastically deforms according to the displacement of the members to be bonded (M, M), to the bonding surfaces S.