Current Sensor Shunt Resistor Erected Perpendicular
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Solution Overview
Problem
Conventional current sensors face challenges in suppressing the influence of heat generated by the shunt resistor, which can affect the accuracy and reliability of current measurement.
Innovation Solution
The current sensor design includes a shunt resistor formed in a plate shape, electrically connected to a battery terminal portion and a circuit board, where the shunt resistor is erected on the circuit board's main surface perpendicularly, allowing for effective heat dissipation through the bus bars and housing, reducing heat transfer to the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the shunt resistor is mounted in a conventional flat configuration, then the device complexity is reduced, but the heat dissipation performance deteriorates causing temperature rise on the circuit board
Solution Approach 1:
The shunt resistor is mounted in an erected position perpendicular to the main surface of the circuit board, transitioning from a conventional flat two-dimensional mounting to a three-dimensional configuration. This dimensional change increases the distance between the heat-generating shunt resistor and the circuit board, thereby improving heat dissipation and reducing temperature rise on the circuit board.
2Loss of energy
If the shunt resistor is erected perpendicular to the circuit board, then heat dissipation is improved, but the device complexity increases
Solution Approach 1:
The shunt resistor is mounted in an erected position perpendicular to the main surface of the circuit board, transitioning from a conventional flat two-dimensional mounting to a three-dimensional configuration. This dimensional change increases the distance between the heat-generating shunt resistor and the circuit board, thereby improving heat dissipation and reducing temperature rise on the circuit board.
3Volume of stationary object
If the shunt resistor is mounted close to the circuit board, then the device size is reduced, but the heat transfer to the circuit board increases
Solution Approach 1:
The shunt resistor is mounted in an erected position perpendicular to the main surface of the circuit board, transitioning from a conventional flat two-dimensional mounting to a three-dimensional configuration. This dimensional change increases the distance between the heat-generating shunt resistor and the circuit board, thereby improving heat dissipation and reducing temperature rise on the circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the temperature rise on the circuit board, enhancing heat dissipation and maintaining accurate current measurements even with electronic components of low heat resistance, while allowing for higher continuous current capabilities.
Implementation Method 1
allowing for effective heat dissipation through the bus bars and housing, reducing heat transfer to the circuit board
Data Source
AI summary
A current sensor includes a battery terminal portion that is conductive and is fastened to a battery post; a shunt resistor for current detection, which is formed in a plate shape and is electrically connected to the battery terminal portion; and a circuit board that is formed in a plate shape and is electrically connected to the shunt resistor, in which the shunt resistor is erected on a main surface of the circuit board. With this configuration, since the shunt resistor and the circuit board can be arranged so as not to face each other and not confront each other, the influence of heat generated by the shunt resistor can be suppressed.