Temperature Compensation Modification TRIZ Cases
- Cooling device for semiconductor inspection apparatus to adjust temperature of inspection apparatus of semiconductor wafer
See how a bypass passage and dual-valve system enable a single cooling device to inspect semico
- Current Sensor Shunt Assembly With Integrated Temperature Sensing
An integrated shunt resistance section enables direct temperature sensing, reducing welding joints, power loss, and current measurement error.
- Pogo Pin Cooling Channels for High-Power Chip Testing
Cooling fluid routed through pogo pins and solder ball contacts removes test heat, preventing melting, contamination, and socket failures.
- Dual-Element Battery Shunt With TCR Tuning and Redundant Sensing
Slots in a dual-element battery shunt tune TCR and isolate sense points, cutting space, cost, and extra temperature compensation parts.
- Non-Contact DC Loop Potential Sensing With Vibration Demodulation
Weak DC loop fields are converted into measurable AC signals, then demodulated and corrected for interference and environmental drift.
- Dual-Element Battery Shunt With TCR Adjustment Slots
Integrated dual resistive elements and TCR adjustment slots enable redundant current sensing with less space, cost, and compensation complexity.
- MOSFET Load Driver Current Sensing via Rds(on) and Temperature
By combining drain-source voltage with MOSFET temperature, this circuit senses load current without shunt resistor cost, loss, or voltage drop.
- External MOSFET Current Sensing Without Shunt Resistors
Current is derived from MOSFET VDS and temperature-dependent RdsON, avoiding shunt resistors, voltage drop, and extra power loss.
- Common-Mode Current Sensing in Piezoresistive Bridge Feedback
Separating common-mode feedback and op-amp currents enables accurate piezoresistive bridge current measurement for temperature compensation.
- Probe-card multilayer wiring substrate and probe card
An embedded heat sink with an exposed dissipating portion cools probe-card thin-film resistors, reducing thermal deterioration and substrate complexity.
- Probe Assembly Thermal Compensation for Wafer Test Alignment
Opposing thermal expansion in the probe holder and adaptor offsets temperature-driven length changes to keep wafer test probe tips aligned.
- Wafer Air-Bearing Probe Inspection for Uniform Contact Pressure
Pressurized air levitates the wafer during optical and electrical probing, preventing warping and keeping probe pressure uniform for accurate testing.
- Segmented Probe Head Assembly for Thermal Expansion Stability
A containment-supported segmented guide structure controls thermal expansion in large probe heads, improving pad contact at extreme temperatures.