Heat Dissipatable Die Unit with Nested Metal Layer

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Solution Overview

Problem

Conventional probe heads experience deformation and inaccurate probe tip positioning due to temperature differences between inner and outer dies during high-temperature testing, leading to heat dissipation issues and potential mechanical and electrical performance degradation.

Innovation Solution

A heat dissipating layer is introduced between the outer and inner dies, with a specific structural configuration that includes a recessed portion on the inner die and a protruding portion on the outer die, allowing for effective heat dissipation without increasing the probe length or probe seat depth, ensuring the probes' high-frequency properties and mechanical integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal heat dissipating layer is added between the inner die and outer die, then heat dissipation is improved, but the thickness of the die unit increases

Engineering Contradiction:

Improveheat dissipationVSAvoidthickness of die unit

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The metal heat dissipating layer is nested within the existing die unit structure by utilizing the space between the inner die and outer die. The recessed portion in the inner die and protruding portion on the outer die create a dedicated cavity that accommodates the heat dissipating layer without requiring additional external space, thus improving heat dissipation while maintaining the original thickness constraints.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

Instead of increasing thickness in the vertical dimension, the invention redistributes space within the horizontal plane by creating recessed and protruding portions. This allows the heat dissipating layer to be integrated in a different spatial arrangement that doesn't compromise the overall thickness of the die unit.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If the die unit thickness is increased to accommodate heat dissipating structures, then heat dissipation is improved, but the probe seat depth increases

Engineering Contradiction:

Improveheat dissipationVSAvoidprobe seat depth

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The heat dissipating structures are nested within the existing die unit boundaries. The recessed portion in the inner die and protruding portion on the outer die create an internal cavity that houses the heat dissipating layer without extending the external dimensions of the probe seat, thus maintaining compatibility with test machine specifications.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Temperature

If the probe length is increased to compensate for increased die unit thickness, then the heat dissipation structure can be accommodated, but the high-frequency properties and mechanical integrity of the probe are degraded

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidprobe performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The heat dissipating layer is nested within the die unit structure between the inner and outer dies, utilizing the space created by recessed and protruding portions. This internal integration allows the heat dissipation function to be added without increasing the external dimensions of the probe assembly, thereby maintaining probe length within specifications that ensure proper high-frequency performance and mechanical integrity.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the impact of heat on die deformation, maintains the required probe seat depth, and prevents excessive probe length, thereby ensuring accurate positioning and performance under high-temperature conditions while meeting the specifications of test machines.

Implementation Method 1

the metal heat dissipating layer can transmit heat from where close to the center of the probe head, i.e., the inside of the probe head, to the outer periphery of the probe head so as to dissipate the heat to the external environment

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the heated inner and outer dies 152 and 154 have a temperature difference therebetween, so that the inner and outer dies 152 and 154 will deform with different degrees

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12050235B2Heat dissipatable die unit and probe seat using the same

Publication Date: 2024.07.30 MPI CORP

AI summary

A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.