Mirror-Polished Ceramic Stage for Rapid Temperature Control
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Solution Overview
Problem
Existing stages used in semiconductor inspection apparatuses face challenges in maintaining high rigidity, load resistance, and rapid temperature control due to increased heat generation in electronic devices, requiring improved heat absorption and heating structures with reduced thermal capacity and contact thermal resistance.
Innovation Solution
A stage design incorporating a ceramic top plate with a mirror-polished surface, integrated LED modules for heating, and a three-dimensional coolant flow path structure to facilitate rapid temperature adjustments within a predetermined range, using ceramic materials like silicon carbide for high rigidity and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a conventional stage structure is used, then structural simplicity is maintained, but temperature control speed and thermal capacity are insufficient
Solution Approach 1:
The stage is divided into multiple functional layers: a top plate for sample placement, a heat generation unit with LED modules, a heat absorption unit with coolant flow paths, and a support structure. This segmentation allows each component to be optimized for its specific function, enabling rapid temperature control while maintaining overall structural efficiency
Solution Approach 2:
The heat absorption unit with coolant flow paths is integrated within the stage structure, and the heat generation LED modules are positioned in close proximity. This nested arrangement minimizes thermal resistance and allows rapid heat transfer, achieving fast temperature control without requiring a bulky external structure
2Temperature
If heat absorption and generation units are added for rapid temperature control, then temperature control capability is improved, but contact thermal resistance increases
Solution Approach 1:
The contact surfaces between the top plate and heat generation units, and between heat generation/absorption units, are mirror-polished to achieve extremely low surface roughness. This local quality improvement at critical contact interfaces minimizes contact thermal resistance, enabling efficient heat transfer while maintaining rapid temperature control capability
Solution Approach 2:
The surface roughness parameter of contact interfaces is changed from conventional values to mirror-polished surfaces with minimal roughness. This parameter change significantly reduces contact thermal resistance, allowing efficient thermal coupling between components for rapid temperature control
3Object-affected harmful factors
If the top plate surface is mirror-polished, then contact thermal resistance is reduced, but manufacturing complexity increases
Solution Approach 1:
The surface roughness parameter of the top plate is changed to mirror-polished finish, which dramatically reduces contact thermal resistance. Although this increases manufacturing complexity, the use of standardized mirror-polishing processes and the critical importance of thermal efficiency justify the additional manufacturing step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stage achieves efficient temperature control with high throughput by minimizing contact thermal resistance and ensuring rapid heating and cooling capabilities, maintaining electronic devices within a ±3°C temperature range during inspections.
Implementation Method 1
a plurality of LED modules 130 are mounted on the top surface of the base portion 121
Implementation Method 2
the top plate 160 and the middle plate 120 are in close contact with each other
Data Source
Figure 1
Figure 2
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AI summary
A stage (100, 100M) on which an inspection object (W) having an electronic device is placed, the electronic device being pressed against a contact terminal (24a) of a probe card (24) of an inspection apparatus (1) by applying a load, includes: a first cooling plate (120) including a first coolant flow path (123) formed in the first cooling plate (120); a heating source (130) mounted on the first cooling plate (120) and configured to heat the inspection object (W); a transmission member (150) installed on the heating source (130) and transmits light output from the heating source (130); and a second cooling plate (160) installed on the transmission member (150), including a placement surface (160A) configured to vacuum-suction the inspection object (W) and a second coolant flow path (161A, 162A), made of ceramic, and subjected to a mirror polishing process on the placement surface (160A).