MEMS Probe Testing System Multi-Axis Alignment
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Solution Overview
Problem
Current MEMS testing systems fail to simultaneously measure mechanical and electrical properties effectively due to limitations in probe-based methods, such as restricted directional testing, inability to measure stiffness and force directly, and lack of combined electrical and mechanical data acquisition, leading to measurement errors and inefficiencies in validating designs and quality control.
Innovation Solution
A probe-based MEMS testing system that combines micromechanical and electrical testing using motorized, multi-axis micropositioning units with integrated microforce and electrical probes, enabling precise alignment, direct measurement of mechanical properties, and simultaneous observation of the MEMS structure, allowing for both vertical and horizontal testing on structured and non-flat chips/wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical methods (laser Doppler vibrometer) are used for MEMS testing, then fast non-contact deflection measurement over a large frequency range is achieved, but direct measurement of stiffness, force, linearity, hysteresis, and yield strength is not possible
Solution Approach 1:
The patent combines optical deflection measurement with probe-based mechanical force measurement into a single integrated testing system. The mechanical probe directly contacts the MEMS structure to apply force and measure mechanical properties (stiffness, force, linearity, hysteresis, yield strength) while the optical system simultaneously measures deflection, enabling both direct mechanical measurement and fast non-contact deflection measurement to occur together
Solution Approach 2:
The patent introduces a mechanical probe as an intermediary between the testing system and the MEMS structure. This probe serves as a mediator that can directly measure mechanical properties while the optical system acts as another intermediary for non-contact deflection measurement, allowing both measurement methods to complement each other without interference
2Adaptability or versatility
If conventional MEMS testing systems are used, then testing can be performed, but combined measurement of both mechanical properties and electrical signals cannot be offered
Solution Approach 1:
The patent creates a universal testing system that can perform multiple functions: mechanical property measurement through probe-based testing, electrical signal measurement through integrated probes, and optical deflection measurement. This multi-functional system eliminates the need for separate testing equipment and enables simultaneous acquisition of mechanical and electrical data from MEMS devices
Solution Approach 2:
The patent merges mechanical testing capabilities with electrical testing capabilities into a single integrated system. The mechanical probe and electrical probes are combined in one testing platform, allowing simultaneous measurement of mechanical properties (force, stiffness, deflection) and electrical signals (voltage, current, resistance, capacitance, charge) without requiring separate testing equipment
3Measurement precision
If atomic force microscopes and nanoindentors are used, then mechanical properties can be measured, but the systems are limited to vertical measurements only and cannot be used for in-plane deflection/force measurement
Solution Approach 1:
The patent extends measurement capabilities from single-axis (vertical) to multi-axis by incorporating a multi-axis micropositioning unit with at least two degrees of freedom. This allows the mechanical probe to apply forces and measure deflections in both vertical and in-plane directions, enabling comprehensive mechanical characterization of MEMS structures in multiple dimensions simultaneously
4Adaptability or versatility
If a conductive tip is used for electrical probing, then electrical probing is possible, but only with the microforce sensor rather than with additional electrical probes
Solution Approach 1:
The patent separates the mechanical probing function from the electrical probing function by using distinct probes: a mechanical probe for force and stiffness measurement, and separate electrical probes for voltage, current, resistance, capacitance, and charge measurement. This segmentation allows each probe to be optimized for its specific function while working together in an integrated testing system
Data Source
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AI summary
A system (100) for testing MEMS-structures comprises - a microforce sensor (1); - two or more multi-axis micropositioning units (2); - at least one or electrical probe (4); - a sample holder (5) on which a MEMS-structure (6) is mounted. At least one of said multi-axis micropositioning units (2) is motorized and at least one additional micropositioning unit (2) is equipped with at least one electrical probe (4) to apply electrical signals or to measure electrical signals at one or multiple locations on the MEMS structure (6). The system with the before mentioned components allows a combined electrical and probe-based mechanical testing of MEMS-structures (6).