Segmented Probe Head Assembly for Thermal Expansion Stability
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Solution Overview
Problem
Existing probe heads for testing electronic devices, particularly large ones like DRAMs, face issues with thermal expansion and misalignment due to different thermal expansion coefficients of components, leading to malfunctions and poor contact at extreme temperatures.
Innovation Solution
The probe head is manufactured by initially connecting guides as a single plate to a containment element, then cutting them into independent guide portions, with the containment element supporting the guides to control thermal expansion and simplify assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If guides are made as separate components with different materials, then manufacturing flexibility is improved, but thermal expansion mismatch causes misalignment and malfunctions at extreme temperatures
Solution Approach 1:
The patent merges multiple guide components into a single monoblock guide structure made of a uniform material. This eliminates the interfaces between different materials that cause thermal expansion mismatch, thereby resolving the contradiction by prioritizing thermal stability while maintaining manufacturing capability through single-piece fabrication.
Solution Approach 2:
The patent employs a monoblock guide made of a single material with controlled thermal expansion properties. By using composite material principles in reverse (i.e., avoiding composites of different materials), the design ensures uniform thermal behavior across the entire guide structure, preventing misalignment at extreme temperatures.
2Reliability
If guides are made as a single monoblock, then thermal expansion control is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent combines multiple guide functions into a single monoblock structure, which simplifies the manufacturing process by eliminating the need to assemble multiple components. This resolves the contradiction by reducing manufacturing complexity while maintaining excellent thermal expansion control through the uniform material structure.
3Ease of operation
If guides are divided into multiple separate portions, then assembly flexibility is improved, but alignment precision deteriorates due to thermal expansion differences
Solution Approach 1:
The patent merges separate guide portions into a single integrated monoblock structure. This eliminates alignment issues caused by thermal expansion differences between separate components, thereby resolving the contradiction by prioritizing alignment precision while maintaining assembly capability through the unified structure.
4Adaptability or versatility
If multiple separate guides are used, then adaptability to different configurations is improved, but thermal distortion increases leading to malfunctions
Solution Approach 1:
The patent merges multiple separate guides into a single monoblock structure, which eliminates thermal distortion caused by differential expansion of separate components. This resolves the contradiction by ensuring thermal reliability while maintaining configuration adaptability through the robust unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures reliable electrical contact at extreme temperatures by managing thermal expansion effectively, simplifying assembly, and reducing manufacturing time and costs.
Implementation Method 1
thermal expansion and misalignment due to different thermal expansion coefficients of components
Data Source
AI summary
A method for manufacturing a probe head for the functionality testing of devices under test (DUT) is disclosed. The method includes providing a containment element, arranging a lower guide at a lower face of the containment element which faces toward the devices under test during the test, and arranging an upper guide at an upper face of the containment element. The containment element is interposed between the lower and upper guides which are initially in the shape of a single plate connected to the containment element. The method further includes cutting the lower and/or upper guide thereby defining a plurality of guide portions that are independent and separated from each other, and inserting a plurality of contact elements into respective guide holes formed in the guides. The contact elements are adapted to contact pads of the devices under test. A probe head obtained by the method is also disclosed.