Curved Photosensitive Chip Assembly for Focal Plane Alignment
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Solution Overview
Problem
Existing camera module manufacturing processes face challenges such as chip deformation, poor heat dissipation, and difficulties in transporting curved photosensitive chips, which affect imaging quality.
Innovation Solution
A photosensitive assembly is designed where a flat photosensitive chip is bent into a shape adapted to the actual focal imaging plane through a special manufacturing process, and a heat dissipation member is included to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the size of photosensitive chips is increased to meet higher image quality requirements, then imaging performance is improved, but chip deformation and heat dissipation problems worsen
Solution Approach 1:
The patent applies curvature by bending the photosensitive chip from a flat state into an arc shape that matches the focal imaging plane. The shaping member provides a curved surface with a predetermined radius of curvature, allowing the chip to conform to the spherical/arc-shaped focal plane, thereby eliminating deformation issues while maintaining high imaging quality.
2Measurement precision
If the size of photosensitive chips is increased to meet higher image quality requirements, then imaging performance is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a new dimension for heat dissipation by creating a three-dimensional accommodating space beneath the bent photosensitive chip. This space allows heat dissipation structures to be positioned in a different spatial dimension (below the chip), enabling effective thermal management without interfering with the chip's imaging function on the focal plane.
3Measurement precision
If a flat photosensitive chip is bent into a curved shape to match the focal plane, then imaging quality is improved, but the chip can no longer be transported in array form
Solution Approach 1:
The patent applies preliminary action by keeping the photosensitive chip flat during manufacturing and transportation, then performing the bending operation only at the final assembly stage. The shaping member is prepared in advance on the circuit board, and the chip is bent to match its shape only when needed, preserving ease of transportation while achieving the required curved configuration for high imaging quality.
4Ease of manufacture
If existing photosensitive chip manufacturing processes are used to produce flat chips, then manufacturing simplicity is maintained, but the chips cannot adapt to curved focal imaging planes
Solution Approach 1:
The patent segments the manufacturing process into two independent stages: first, producing flat photosensitive chips using existing simple manufacturing processes; second, shaping the chips to match the focal plane using the shaping member. This segmentation allows each stage to be optimized independently, maintaining manufacturing simplicity while achieving precise adaptation to the curved focal plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the imaging quality of the camera module by aligning the photosensitive chip with the actual focal plane and enhances heat dissipation performance, while maintaining the chip in a plane shape for transportation.
Implementation Method 1
the accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly
Data Source
Figure 1
Figure 2~3
Figure 4A
AI summary
Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board. The accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process, so as to improve the imaging quality.