Curved Electronic Circuit Production Using Elastic Membrane Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for collectively producing curved electronic circuits face challenges such as requiring constant external force, generating mechanical stresses, being temperature-dependent, and being incompatible with high-resolution systems, especially when dealing with multiple circuits on the same substrate.
Innovation Solution
A method involving a support with rigid membranes that are elastically deformed to impose curvature on electronic components without constant external force, allowing for precise spherical curvature over the entire surface, independent of temperature, and compatible with multiple circuits on the same substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a force is applied against the support to obtain curvature, then the curved electronic circuit is achieved, but the force must be constantly applied which represents a significant constraint
Solution Approach 1:
The support is pre-formed with the desired curvature before the electronic circuit is mounted on it. This preliminary shaping eliminates the need for constant force application during operation, as the curvature is already established in the support structure itself
Solution Approach 2:
An adhesive layer is introduced as an intermediary between the electronic circuit and the curved support. This adhesive layer allows the circuit to conform to the pre-formed curved support without requiring continuous external force to maintain the curvature
2Shape
If a cavity depression method is used to curve the circuit, then spherical curvature is obtained, but significant mechanical stresses are generated at the edges which weaken the circuit
Solution Approach 1:
Instead of deforming the circuit by depressing a cavity from the opposite side, the support itself is pre-formed with the desired spherical curvature. The circuit is then mounted on this pre-curved support, inverting the traditional approach and avoiding edge stress concentration
Solution Approach 2:
The adhesive layer acts as a flexible thin film that allows the rigid electronic circuit to conform to the spherical curvature of the support without generating significant mechanical stresses at the edges
3Shape
If thermal expansion difference method is used to obtain curvature, then curved electronic circuit is achieved, but the process is not adapted to collective embodiment of several circuits and temperature adjustment degrades imager quality
Solution Approach 1:
The support structure serves multiple functions: it provides the desired spherical curvature, enables collective mounting of multiple electronic circuits simultaneously, and maintains this curvature without temperature adjustment, thus not degrading imager quality
Solution Approach 2:
The support is pre-formed with the exact curvature needed before any circuits are mounted. This allows multiple circuits to be collectively embodied on the same support without requiring individual curvature adjustment for each circuit, and without needing thermal expansion differences
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the collective production of curved electronic circuits with precise, temperature-independent curvature, reducing mechanical stress and maintaining high-resolution capabilities, suitable for various applications like imagers and displays.
Implementation Method 1
Application of a force against one of the main faces of each of the membranes such that said membrane is elastically deformed and has a substantially flat shape under the effect of this force; Withdrawal of the force applied against one of the main faces of each of the membranes such that each of the membranes regains its radius of curvature R initial
Data Source
Figure 1~4
Figure 5~7
AI summary
The invention relates to a method for producing a plurality of curved electronic circuits (100), comprising the steps of: producing a substrate (102) comprising a plurality of membranes (104) made from at least one material having a rigidity of more than around 100 MPa, each intended for being part of one of the electronic circuits and having a radius of curvature R of 15 mm to 500 mm; applying a force to one of the main surfaces (110) of each of the membranes, so that said membrane deforms resiliently and has a substantially planar shape when exposed to said force; rigidly connecting at least one electronic component (112) to each of the membranes; and removing the force applied to one of the main surfaces of each of the membranes so that each of the membranes returns to its original radius of curvature R and curves the electronic component according to this radius of curvature R.