Curved Display Driving Chips Spaced Apart to Reduce Bending Stress
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Solution Overview
Problem
Conventional curved display devices face issues with stress-induced defects such as cracks and peeling of semiconductor chip packages due to bending, which affects the durability and reliability of the devices.
Innovation Solution
The design includes a semiconductor chip package with multiple driving chips spaced apart along the bending direction, connected by input and output wire units, and a printed circuit board and display panel that are all bendable, reducing stress through flexible configurations and wire arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a semiconductor chip package is used in a curved display device, then the device can provide a bent screen with 3D effect and improved viewing angles, but stress-induced defects such as cracks and peeling occur during bending
Solution Approach 1:
The semiconductor chip package is divided into multiple separate driving chips arranged in a matrix pattern rather than a single continuous chip. This segmentation allows each chip to independently accommodate bending stress, preventing the propagation of cracks across the entire package and eliminating peeling issues at chip edges during curvature formation
Solution Approach 2:
Different regions of the chip package are designed with varying properties: the driving chips are positioned at specific locations optimized for stress distribution, wire connections are routed through stress-relief pathways, and the substrate material properties are adjusted locally to enhance flexibility at critical bending zones while maintaining structural integrity at connection points
2Reliability
If multiple driving chips are spaced apart in the bending direction, then stress during bending is reduced and defects are suppressed, but the device complexity increases
Solution Approach 1:
Multiple driving chips are integrated onto a single substrate and interconnected through a standardized wire connection architecture. The input wire unit and output wire unit are merged into a unified wiring system that distributes signals to all chips, reducing the overall system complexity despite the increased number of individual chip components
Solution Approach 2:
The substrate and wire connection structure are designed to serve multiple functions simultaneously: providing mechanical support for the separated chips, routing electrical signals between chips and external connections, and accommodating the curved geometry of the display. This multi-functionality reduces the need for additional specialized components
Data Source
AI summary
A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips, a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package, and a display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package, wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction.