Circuit Bendability/Stretchability TRIZ Cases

Extra tracks engage to contain adhesive leakage, protecting electronic circuitry integrity during compression.

A flexible printed circuit jumper with raised metal contact pads connects components to a housing via a pressing metal bracket.

Segmented coupling film connects circuit boards to display panels while dispersing mechanical stress, preventing cracking and tearing caused by misalignment.

A circuit board structure uses a rigid layer with lower dielectric loss to connect flexible boards.

Segmented driving chips and flexible wiring distribute bending stress to suppress cracks and peeling in curved display devices.

A buffer layer adjusts the neutral axis position in a flexible electronic device, reducing tensile stress and preventing component damage from bending.

An optical sensing system replaces mechanical components to eliminate backlash and ensure precise firing strokes in surgical stapling operations.

Routing a chip-on-film through a wiring gap with an adapter structure reduces bezel width without increasing module thickness.

A multilayer substrate features a wave-shaped flexible portion with wider turn-back sections to distribute stress across the wiring layer.

Vertical electroplated pillars stack pads within flexible substrates, resolving the trade-off between high connectivity and structural complexity.

Relocating the flexible flat cable contact point to the side surface of an LED exposure head prevents breakage during maintenance exchanges.

Dummy printed wiring layers on a flexible wiring board prevent rubber burr formation during molding, ensuring reliable waterproof sealing.

Slanted side walls on curving-restricting structures resist excessive curvature, protecting brittle thin film transistors from over-bending damage.

Widening reinforcing portions between the flexible base and outer leads distributes assembly stress, preventing lead breaks during TAB bonding.

Graded stiffness stress buffers reduce peeling stress, preventing conductive wire damage during carrier separation.

An elastic electrical cable uses an elastomer band with a tortuous path to provide adaptive physical and electrical coupling between wearable device components.

Segmented plating layers on flexible circuit board pads prevent pseudo welding by optimizing thickness for insulation penetration and lead wire coverage.

A variable stiffness flexible display incorporates an electro-rheological fluid layer between electrodes to adjust mechanical rigidity dynamically.

Embedding a low thermal expansion frame member in the flexible substrate resolves the trade-off between bending capability and dimensional stability.

Selective dewetting of liquid overcoats on patterned low surface energy materials creates reliable electrical connections between non-adjacent nanowire layers.

Segmenting the display panel base into varying thickness regions prevents cracking at the flexible printed circuit board connection area during assembly.

Stacked circuit boards position signal lines lower to resolve gold wire height constraints that limit lens module thickness reduction.

Sliding blocks in backplate grooves allow circuit board corners to move freely, reducing interaction forces and preventing deformation.

A waterproof film seals the gap between a display panel and housing, maximizing screen output area while maintaining dustproof and waterproof protection.

A flexible substrate manufacturing method uses a release layer to peel off a glass carrier, reducing mechanical load on the insulating base during separation.