Flexible Electronic Device Stress Buffer for Peeling Integrity

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Solution Overview

Problem

Flexible electronic devices often crack during peeling from carriers due to the higher stiffness of components compared to the flexible substrate, leading to damage and breakage of conductive wires.

Innovation Solution

Incorporating stress buffers with gradually increasing stiffness adjacent to the components, which are designed to reduce peeling stress and prevent cracking by distributing the force more evenly during the peeling process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the component with high stiffness is formed on the flexible substrate, then the component provides structural support and functionality, but the flexible substrate is prone to cracking during peeling from the carrier

Engineering Contradiction:

Improvecomponent stiffnessVSAvoidsubstrate integrity

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

A stress buffer layer is introduced as an intermediary between the flexible substrate and the rigid component. This buffer layer has intermediate stiffness properties that are higher than the flexible substrate but lower than the component, serving as a transition zone that reduces stress concentration and prevents cracking during the peeling process

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The stress buffer layer's stiffness parameter is specifically designed to be between that of the flexible substrate and the rigid component. By changing the material composition or structural parameters of the buffer layer, it creates a gradual stiffness transition that mitigates the harmful stress concentration effect

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If the flexible substrate is peeled off from the carrier, then the flexible electronic device is completed, but conductive wires may be damaged due to stress concentration

Engineering Contradiction:

Improvepeeling processVSAvoidconductive wire damage

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The stress buffer layer is formed beforehand on the flexible substrate before the rigid component is attached. This pre-formed buffer layer acts as a cushion that absorbs and distributes peeling stresses during the subsequent peeling process, protecting the conductive wires from damage before the harmful stress can concentrate on them

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The stress buffers effectively reduce peeling stress, allowing for the smooth peeling of flexible substrates from carriers without damaging conductive wires, thereby enhancing the integrity and reliability of flexible electronic devices.

Implementation Method 1

The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component

Methodology Applied

Scientific EffectStress distribution:

Data Source

PatentUS9743513B2Flexible electronic device

Publication Date: 2017.08.22 HANNSTAR DISPLAY CORP

AI summary

According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.