Rigid-Flex PCB Frame Member for Thermal Stability
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Solution Overview
Problem
The increasing demand for high-performance devices with ultra-high definition displays and antenna modules requires a printed circuit board with a rigid-flex structure that can achieve high circuit density in a confined space, necessitating advanced technologies for mounting electronic devices and implementing fine circuits on flexible substrates.
Innovation Solution
A printed circuit board design featuring a first rigid substrate and a second flexible substrate with a bendable insulation layer, incorporating a frame member made of materials like metal, ceramic, or alloy with low thermal expansion to enhance strength and dimensional stability, allowing for precise circuit patterns and electronic element mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate is used to enable bending and compact configuration, then adaptability and space utilization are improved, but strength and dimensional stability deteriorate
Solution Approach 1:
The patent uses a composite structure consisting of a flexible substrate and a rigid frame member. The flexible substrate provides bending capability while the rigid frame member embedded within it provides structural strength and dimensional stability. This composite approach allows the PCB to be both flexible and strong simultaneously.
2Productivity
If circuit density is increased in a confined space, then productivity and device performance are improved, but manufacturing precision and reliability worsen
Solution Approach 1:
The patent divides the PCB into distinct regions: a rigid first substrate portion for high-precision circuit areas and a flexible second substrate portion for compact configurations. This segmentation allows different manufacturing precision requirements to be met in different areas while achieving overall high circuit density.
3Volume of moving object
If a rigid-flex structure is implemented to achieve compact configuration, then volume reduction is improved, but device complexity increases
Solution Approach 1:
The patent embeds the rigid frame member within the flexible substrate, creating a nested structure where one component is integrated into another. This nesting approach reduces overall PCB volume while managing structural complexity through hierarchical integration rather than separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the creation of a rigid-flex printed circuit board with improved strength, thermal stability, and precise circuit formation, supporting high-density circuitry and reliable electronic component mounting, suitable for high-frequency applications.
Implementation Method 1
a frame member made of materials like metal, ceramic, or alloy with low thermal expansion to enhance strength and dimensional stability
Data Source
AI summary
A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulation layer which is bendable, and the second substrate portion includes a frame member inserted into the flexible insulation layer.