Lens Module Thickness Reduction via Stacked Circuit Boards
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Solution Overview
Problem
Existing lens modules face challenges in reducing thickness due to the height of gold wires between the sensor chip and the circuit board, limiting further miniaturization efforts.
Innovation Solution
The implementation of a dual-circuit board structure with a conductive adhesive layer and a reinforcement plate, where the signal line is positioned to be lower than the first circuit board, reducing the overall thickness by minimizing the height of the signal line and allowing for a reduced back focal length and thinner module design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a hole is opened in the circuit board and sensor chip is attached to steel sheet, then thickness of lens module is reduced, but gold wire height limits further thickness reduction
Solution Approach 1:
The patent transitions from traditional planar circuit board layout to a three-dimensional stacked architecture where the sensor chip is vertically positioned above the circuit board. This dimensional change allows signal lines to be routed through vertical vias rather than horizontal traces, reducing the horizontal space required and enabling thinner module design.
Solution Approach 2:
The patent implements a nested structure where the sensor chip is positioned within a cavity formed in the circuit board, and the gold wire bonding is contained within this nested configuration. The steel sheet is integrated into the cavity structure, creating a compact nested arrangement that reduces overall thickness while maintaining structural integrity.
2Length of stationary object
If gold wire height is reduced to minimize thickness, then electrical connectivity may be compromised
Solution Approach 1:
The patent applies different structural qualities to different regions: the circuit board features a localized cavity structure where the sensor chip is positioned, allowing optimized gold wire routing in this specific region. The steel sheet is strategically placed to provide mechanical support precisely where needed, enabling shorter gold wires while maintaining both electrical connectivity and structural reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the thickness of the lens module, enhances dust protection for the image sensor, and provides design flexibility for selecting shorter back focus lenses and thicker filters, while maintaining electrical connectivity.
Implementation Method 1
a conductive adhesive layer bonded to the first circuit board and the second circuit board
Data Source
AI summary
A lens module includes a first circuit board, a second circuit board, an image sensor, a signal line, a mounting bracket, a filter, and a lens unit. The first circuit board defines a first through hole. The second circuit board is coupled to the first circuit board. The second circuit board defines a second through hole aligned with the first through hole. A width of the first through hole is larger than a width of the second through hole. The image sensor is received in the second through hole. The signal line couples the image sensor to the second circuit board. The mounting bracket is disposed on a side of the first circuit board facing away from the second circuit board. The filter is disposed on the mounting bracket. The lens unit is disposed on the mounting bracket.