Flexible Substrate Manufacturing via Release Layer Peeling
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Solution Overview
Problem
Flexible substrates face challenges in preventing wiring damage due to stress caused by bending or stretching, which existing measures such as honeycomb-shaped openings or meandering wiring shapes do not adequately address.
Innovation Solution
A method of manufacturing a flexible substrate involves forming a release layer on a glass substrate, creating an insulating base and multiple insulating layers with wiring and electrical elements, and then peeling off the glass substrate and release layer to form resin layers that protect the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If honeycomb-shaped openings or meandering wiring shapes are used to prevent wiring damage, then wiring protection is improved, but the structural integrity and manufacturing complexity are worsened
Solution Approach 1:
The base structure is divided into multiple islands separated by gaps, creating a segmented architecture that allows independent movement of each island during bending without transmitting stress to the wiring. This segmentation approach protects wiring while maintaining structural integrity through the distributed island configuration.
Solution Approach 2:
The patent introduces a vertical dimension by stacking multiple layers (base, insulating layers, wiring layers, sealing layers) to create a three-dimensional structure. The wiring is routed through multiple layers and connected via vias, allowing the wiring to accommodate bending stress through vertical movement rather than being constrained to a single plane.
2Ease of manufacture
If the glass substrate is peeled off directly from the insulating base, then manufacturing simplicity is maintained, but the load on the insulating base increases causing damage
Solution Approach 1:
A release layer is introduced as an intermediary between the glass substrate and the insulating base. This release layer has lower adhesion to the glass substrate compared to the insulating base, allowing the glass substrate to be peeled off with minimal force while the insulating base remains intact and undamaged during the separation process.
Solution Approach 2:
The release layer is formed on the glass substrate before the insulating base is formed, creating a preliminary protective and separable interface. This preliminary structure is designed specifically to facilitate easy separation while protecting the subsequent layers from damage during the peeling operation.
3Adaptability or versatility
If the insulating base is made more flexible to accommodate bending, then flexibility is improved, but the wiring becomes more vulnerable to stress
Solution Approach 1:
The base is segmented into multiple islands that can move independently relative to each other during bending. This segmentation allows the base to flex and adapt to curved surfaces while the wiring on each isolated island experiences minimal tensile stress, as the islands can accommodate bending through their relative movement rather than stretching the wiring.
Solution Approach 2:
The wiring structure is nested within multiple insulating layers and sealing layers, creating a protected three-dimensional pathway. The wiring is routed through vias between layers and enclosed by protective sealant, allowing the base to bend while the nested wiring structure remains protected from direct exposure to mechanical stress.
Data Source
AI summary
According to one embodiment, a method of manufacturing a flexible substrate, includes forming a release layer on a glass substrate, forming an insulating base, forming a plurality of insulating layers, wiring lines and electrical elements, asking the release layer, the insulating base and the plurality of insulating layers from above to the glass substrate via a mask, forming an upper resin layer, removing the glass substrate and the release layer by peeling off an interface between the release layer and the insulating base and forming a lower resin layer so as to be in contact with a lower surface of the insulating base and a lower surface of the upper resin layer.