Curved Enclosure Surface for Uniform Thermal Interface Pressure
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Solution Overview
Problem
Existing semiconductor device enclosures with flat surfaces apply non-uniform pressure on thermal interface materials (TIMs), leading to potential deformation, reduced thermal contact, and compromised solder joint reliability due to concentrated pressure at the periphery of the TIMs.
Innovation Solution
The enclosure design features a nonplanar surface, such as a convexly curved surface, to apply uniform pressure to the TIMs, preventing concentration of pressure at the edges and corners, thereby maintaining consistent thermal contact and reducing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat enclosure surface is used to compress the TIM, then the assembly process is simplified, but the pressure becomes non-uniform and concentrates at the periphery of the TIM
Solution Approach 1:
The patent applies a convexly curved surface to the enclosure instead of a flat surface. This curvature allows the enclosure to apply more uniform pressure across the TIM by distributing the compressive force more evenly, preventing concentration at the periphery while maintaining simple assembly
2Device complexity
If a flat enclosure surface is used to compress the TIM, then the structure remains simple, but thermal contact is reduced due to TIM deformation
Solution Approach 1:
The convexly curved surface maintains structural simplicity while improving thermal contact by distributing pressure uniformly across the TIM. This prevents TIM deformation and bulging that would occur with flat surfaces, ensuring consistent thermal contact between the TIM and heat-generating components
3Strength
If screws or clamps are used to secure the enclosure over the TIM, then the enclosure is firmly attached, but the enclosure deforms or bulges causing decreased thermal contact
Solution Approach 1:
The convexly curved surface design inherently distributes compressive forces more evenly across the TIM, preventing the localized deformation and bulging that occurs when screws or clamps are used with flat surfaces. This maintains both firm attachment and consistent thermal contact
4Device complexity
If non-uniform pressure is applied to the TIM, then the enclosure structure remains simple, but solder joint reliability is compromised
Solution Approach 1:
The convexly curved surface distributes pressure uniformly across the TIM and underlying components, preventing excessive stress concentration at corners and edges that would compromise solder joints. This maintains structural simplicity while improving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures uniform pressure distribution across the TIMs, enhancing thermal contact and reducing the risk of deformation and solder joint reliability issues, leading to improved heat dissipation and component protection.
Implementation Method 1
The TIM may fill a gap between the heat-generating component and the package enclosure such that the TIM conducts heat from the heat-generating component to the package enclosure
Data Source
AI summary
A packaged semiconductor device includes a substrate, a heat-generating component positioned on a surface of the substrate, an enclosure at least partially surrounding the substrate and the heat-generating component, and a thermal interface material disposed between the heat-generating component and the enclosure. The enclosure includes a cover portion having a convexly curved surface configured to apply a pressure to the thermal interface material. The pressure may be substantially uniform over the area of the thermal interface material, or may be higher at a center of the thermal interface material than at a periphery of the thermal interface material.