Curved Glass Interconnection Substrates for Optical Alignment
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Solution Overview
Problem
The challenge in high-bandwidth optical communication systems is the high cost and low throughput associated with active alignment processes required for maintaining proper alignment between optical transceiver devices and connectors, particularly due to the decreasing size of optical components like laser diodes and photodiodes, which increases the complexity and expense of optical interconnection.
Innovation Solution
The use of flexible glass interconnection substrates with curved portions and integrated optical waveguides that can be easily aligned and secured to optical components, reducing the need for active alignment processes by providing a flexible and low-loss optical coupling solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment processes are used to maintain proper alignment between optical transceiver devices and connectors, then alignment precision is improved, but manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent applies preliminary action by pre-forming optical waveguides within the glass interconnection substrate before final assembly. The curved portion and waveguide paths are manufactured in advance with precise geometric control, eliminating the need for time-consuming active alignment processes during production. This pre-positioning of optical paths maintains alignment precision while dramatically improving manufacturing throughput.
Solution Approach 2:
The glass interconnection substrate acts as an intermediary component that bridges optical transceiver devices and connectors. It provides a stable mechanical and optical interface with pre-defined waveguide paths, serving as a mediator that eliminates direct alignment requirements between transceivers and connectors. This intermediary structure maintains proper optical coupling while simplifying the assembly process.
2Volume of moving object
If the size of optical transceiver devices is decreased to increase integration density, then device miniaturization is achieved, but alignment complexity and manufacturing cost increase
Solution Approach 1:
The patent merges multiple functions into the glass interconnection substrate, which simultaneously provides mechanical support, optical guidance, and alignment reference structures. By combining the substrate, waveguides, and alignment features into a single integrated component, the system achieves device miniaturization without increasing alignment complexity. The merged structure provides all necessary alignment references internally, eliminating external alignment mechanisms.
Solution Approach 2:
The patent applies local quality by creating specialized regions within the glass substrate with different properties. The curved portion contains concentrated waveguide structures with specific geometric characteristics optimized for compact routing, while other regions provide mechanical support and alignment references. This localized optimization allows miniaturization in critical areas without compromising overall alignment simplicity.
3Shape
If curved portions are introduced in glass interconnection substrates to accommodate compact routing, then space utilization is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the geometric parameters of the curved portion during glass forming. The radius of curvature, arc length, and waveguide path dimensions are optimized to achieve compact routing while remaining compatible with standard glass manufacturing processes. By adjusting these parameters within feasible ranges, the design achieves space-efficient routing without excessive manufacturing difficulty.
Solution Approach 2:
The patent utilizes curvature in the glass interconnection substrate to achieve compact optical routing. The curved portion allows optical waveguides to follow bent paths, enabling compact arrangement of optical components. The curvature is designed with sufficient radius to avoid excessive stress concentration and manufacturing complexity, while still achieving the desired space utilization improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in lower coupling loss, higher optical interconnection density, improved alignment tolerances, and reduced costs, while also accommodating thermal expansion mismatches between different materials, enhancing the reliability of optical connections.
Implementation Method 1
an optical waveguide at least partially positioned within the curved portion
Data Source
AI summary
Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion.