Circuit Optical Details TRIZ Cases

Controlled spray impact on a black resin cured film prevents undercut and adhesion impairment during gold plating processes.

Extract embedded filaments from laminated stacks to form hollow channels, resolving manufacturing complexity while enabling thermal management.

Segmented high-reflection layers on a driving substrate restore reflectivity lost at electrode welding pads, enabling narrow-border full-screen displays.

Transparent blank packages mimic component footprints to reveal hidden solder residue and flux contamination beneath opaque areas during cleaning.

Segmented lattice patterns reduce surface resistance in touch panels, resolving the trade-off between transparency and response speed.

Lateral optical coupling via embedded lenses frees PIC surface area, enabling high-density electrical interconnects without sacrificing signal integrity.

Through holes in a display panel expose electrodes to embed functional components, saving disposing space and increasing screen portion.

Specular reflection from a mirrored printed circuit board surface reduces diffuse scattering and increases luminaire output by approximately 8 lumens.

An analog optical link replaces copper wires between a controller and actuator, eliminating ADC power consumption while maintaining signal integrity.

Optical microstructures absorb or guide light emitted from elements, eliminating bright bands and improving illumination uniformity in backlight modules.

Photo-curing resin bonded by transmitted light eliminates thermal expansion errors, achieving high mounting accuracy.

Clearance glue fills gaps between the lens and rigid PCBs, reinforcing flex joints to reduce module thickness and improve yield rates.

A composite electrode sub-assembly pairs a light-transmissive ceramic layer with a non-ceramic conductive PEDOT:PSS layer.

Composite nano metal wires with transition and oxide layers resist thermal degradation up to 400°C, solving ITO sheet resistance issues.

A transparent conductive polymer electrode uses inkjet printing to deposit droplets at varying hit densities along the electrode line.

A dual-substrate configuration pairs a ceramic first layer with an organic resin second layer to mount imaging elements and lens holders.

Hybrid electrical-optical printed circuit board construct integrates channels within a single physical layer using reflective mesh adhesive.

Protrusions on the lens engage PCB cutouts to prevent rotation, resolving horizontal misalignment in optical sensor packages.

Segmented cover panels with thicker edges reinforce portable terminal perimeters, absorbing drop impacts without increasing overall device thickness.

Segmented common electrode electrically shields detection electrodes, reducing potential variations and enhancing fingerprint pattern accuracy.

Reflective surfaces redirect internal optical signals to the board surface, resolving fabrication complexity while enabling high-bandwidth interconnections.

A circular PCB arrangement positions optical transceivers around a central ASIC to shorten electrical traces, removing retimers and reducing power consumption.

A glass interconnection substrate with a curved portion and integrated optical waveguide couples light between components.

A head-up display mounts its light sensor directly onto the printed circuit support plate alongside the emitter.

A touch panel employs a multi-layer structure with symmetric refractive index distribution to resolve rainbow mura phenomena caused by layer mismatches.

Connector design aligns signal line surfaces to shorten gold wire lengths, reducing impedance discontinuities and optimizing high-frequency performance.

Second wiring on a transmissive member connects electrodes, enabling dense element packing while maintaining heat dissipation.

Metal films fill electrode voids on DCB substrates to boost bonding strength while reflection-preventing glass suppresses light diffusion.

A hollow waveguide traverses multiple wiring board layers to convey high frequency signals between an integrated circuit and an antenna.