Photonic Integrated Circuit Packaging with Lateral Optical Access
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Solution Overview
Problem
Current photonic integrated circuit (PIC) packaging architectures face challenges in achieving high-density, high-bandwidth electrical communication and simultaneous optical access, with existing methods requiring substantial PIC surface area for fiber coupling, limiting electrical interconnect density and supporting small footprint PICs.
Innovation Solution
A photonic packaging architecture that includes a package substrate, an IC, an insulating material, a PIC with an active side and a lateral side perpendicular to the active side, and an optical lens coupled to the PIC on the lateral side, allowing for electrical coupling to the substrate and IC while maintaining optical access, using conductive pillars and interconnects for high-density connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional fiber coupling methods are used, then optical access is achieved, but PIC surface area is substantially occupied limiting electrical interconnect density
Solution Approach 1:
The patent transitions from planar fiber coupling to three-dimensional optical access. Optical lenses are positioned above the PIC surface at vertical distances, enabling optical coupling without occupying lateral PIC surface area. This dimensional transition allows electrical interconnects to be densely packed on the PIC surface while maintaining optical access through the vertical dimension.
2Reliability
If larger PIC surface area is allocated for fiber coupling, then optical coupling is achieved, but electrical interconnect density decreases
Solution Approach 1:
Optical coupling is achieved by positioning lenses in the vertical dimension above the PIC surface rather than requiring lateral surface area. The optical path extends vertically through the package substrate, enabling reliable optical coupling while preserving lateral surface area for high-density electrical interconnects.
Solution Approach 2:
Optical lenses serve as intermediary elements positioned between the optical source and the PIC surface. These lenses focus and direct optical signals vertically onto the PIC's optical elements without requiring direct lateral contact, thereby maintaining optical coupling reliability while freeing up PIC surface area for electrical interconnects.
3Area of stationary object
If smaller footprint PICs are used, then integration density increases, but optical access becomes difficult
Solution Approach 1:
The patent enables optical access to smaller footprint PICs by establishing vertical optical paths. Lenses positioned above the PIC surface can focus optical signals onto small optical elements on the PIC without requiring large lateral clearance. This vertical access approach makes it easy to couple optical signals to compact PIC designs.
4Ease of manufacture
If traditional packaging is used, then manufacturing is straightforward, but electrical interconnect density and optical access cannot be simultaneously achieved
Solution Approach 1:
The package is segmented into distinct functional layers: a package substrate containing electrical interconnects, an insulating material layer, and an optical lens layer positioned above the PIC. This segmentation allows each layer to be optimized independently - the substrate for electrical connections, the insulating layer for electrical isolation, and the lens layer for optical coupling - while maintaining manufacturability through standard layered packaging processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This architecture enables smaller footprint PICs with increased electrical interconnect density and reduced power consumption, while maintaining optical signal integrity and efficiency, facilitating high-speed data transfer and cost-effective optical communication systems.
Implementation Method 1
an optical lens coupled to the PIC on the lateral side
Data Source
AI summary
Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer having a first surface and an opposing second surface, wherein the first layer includes an insulating material, wherein the PIC has an active side, an opposing backside, and a lateral side substantially perpendicular to the active side and backside, and wherein the PIC is embedded in the insulating material with the active side facing up; an integrated circuit (IC) in a second layer at the second surface of the first layer, wherein the IC is electrically coupled to the active side of the PIC; and an optical component, having a reflector, optically coupled to the lateral side of the PIC and extending at least partially through the insulating material in the first layer along the lateral side of the PIC.