Hollow Waveguide Traversing PCB Layers for High Frequency Signal Transfer
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Solution Overview
Problem
High frequency electromagnetic wave emitting or receiving devices face challenges in efficiently transferring signals while maintaining cost-effectiveness, as existing solutions often require expensive special isolating materials with low dielectric constants, especially at frequencies above 1 GHz.
Innovation Solution
The implementation of a hollow waveguide that traverses layers made of normal isolating materials with a higher dielectric constant, eliminating the need for special isolating materials and reducing manufacturing costs, along with non-conductive electromagnetic coupling between the integrated circuit and antenna, and the use of reflective elements within the waveguide to prevent signal leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If special isolating materials with low dielectric constant are used in isolating layers adjacent to high frequency signal lines, then signal transfer efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies local quality by using special isolating materials only in the specific region where they are most needed - in the isolating layer directly adjacent to the high frequency signal line - while using normal, cheaper isolating materials in other regions of the wiring board where high frequency performance is less critical. This localized application maintains signal transfer efficiency where required while reducing overall manufacturing costs.
2Ease of manufacture
If normal isolating materials with higher dielectric constant are used, then manufacturing cost is reduced, but signal transfer efficiency deteriorates
Solution Approach 1:
The patent differentiates between regions requiring high frequency performance and those that do not, applying normal isolating materials in cost-sensitive areas while reserving special materials for the critical signal path region, thus achieving an optimal balance between cost and performance.
Solution Approach 2:
The waveguide structure acts as an intermediary that enables efficient signal transfer through normal isolating materials by providing a dedicated electromagnetic field confinement path, reducing the dependency on special isolating materials for signal integrity.
3Reliability
If waveguide is implemented to transfer high frequency signals, then signal integrity is maintained without special isolating materials, but device complexity increases
Solution Approach 1:
The patent merges the waveguide structure with the existing isolating layers and circuit board architecture, integrating the signal transfer function into the structural components already present in the device, thereby minimizing additional complexity while maintaining signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient high frequency signal transfer without the need for expensive special isolating materials, reducing costs and maintaining signal integrity, while enabling operation at frequencies above 1 GHz.
Implementation Method 1
non-conductive electromagnetic coupling between the integrated circuit and antenna
Implementation Method 2
the use of reflective elements within the waveguide to prevent signal leakage
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
An electronic device (10) comprises: a wiring board (12) having one or more layers (14, 16, 8, 20, 22, 24, 26, 28, 30); an integrated circuit (36) arranged on the wiring board (12); an antenna (38), and a signal path (39). The integrated circuit (36) generates a high frequency signal and feeds it to the signal path. The signal path conveys the high frequency signal to the antenna (38). The antenna (38) emits the high frequency signal into an environment (8) of the electronic device (10). Alternatively or in addition, the antenna (38) receives the high frequency signal from the environment (8) and feeds it to the signal path (39). The signal path (39) conveys the high frequency signal to the integrated circuit (36). The integrated circuit processes the high frequency signal. The signal path (39) comprises a wave guide (40) that traverses one or more of the layers (16, 18, 20, 22, 24, 26, 28, 30) of the wiring board (12). A method of manufacturing an electronic device (10) is also described.