Embedded Optical-Electrical Via with Reflective Surface
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Solution Overview
Problem
Current printed circuit boards (PCBs) lack efficient integration of optical and electrical signal transmission paths, limiting high-bandwidth interconnections and increasing design complexity in electronic systems.
Innovation Solution
A dual optical/electrical connector structure is embedded within the PCB, featuring a via with a reflective surface to direct optical signals and electrically conductive material to connect electrical signals, allowing access to both types of signals on the PCB surface, compatible with existing fabrication technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical signal transmission paths are integrated within the PCB, then high-bandwidth interconnections are enabled, but fabrication complexity increases
Solution Approach 1:
The patent combines optical and electrical signal transmission paths within the same PCB structure, allowing both types of signals to be transmitted through integrated pathways. The via structure simultaneously supports optical signal reflection and electrical signal conduction, merging two previously separate functions into a single integrated component.
Solution Approach 2:
The via structure serves multiple functions: it provides electrical conduction through conductive material, optical signal transmission through reflective surfaces, and structural support. This multi-functional design enables a single component to handle both optical and electrical signaling, reducing the need for separate dedicated structures.
2Quantity of substance
If optical signals are transmitted through internal layers, then high-density interconnections are achieved, but signal access difficulty increases
Solution Approach 1:
The reflective surface within the via acts as an intermediary that redirects optical signals from internal layers to the PCB surface. Instead of requiring direct access to deeply embedded optical paths, the reflective surface mediates by bouncing signals back to accessible points on the board surface, making them easily accessible to external components.
3Reliability
If reflective surfaces are added to via structures, then optical signal transmission is improved, but manufacturing steps increase
Solution Approach 1:
The patent changes the physical parameters of the via structure by adding reflective surfaces with specific optical properties. The reflective surface is positioned at particular angles and depths within the via to optimize optical signal reflection while maintaining compatibility with standard via fabrication processes.
Solution Approach 2:
The via structure becomes a composite element combining conductive materials for electrical signals and optically reflective materials for optical signals. This composite construction allows the same via to handle both signal types simultaneously, integrating multiple material properties into a single manufacturable component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-density, high-bandwidth interconnections by integrating optical and electrical signals in close proximity, enhancing performance and simplifying system design while maintaining compatibility with existing PCB technologies.
Implementation Method 1
The via may include a first reflective surface that is configured to reflect light between the first optical signal transmission path and an opening of the via on the first face
Data Source
AI summary
A system for use with optical and electrical signaling is disclosed. The system may include a printed circuit board (PCB) that includes a plurality of layers vertically stacked between a first face and a second face and a first optical signal transmission path within a first internal layer of the plurality of layers. The PCB may also include an electrical signal transmission path and a via extending through the plurality of layers. The via may include a first reflective surface that is configured to reflect light between the first optical signal transmission path and an opening of the via on the first face and an electrically conductive material that is configured to electrically connect the electrical signal transmission path to a portion of the via on the first face.