Wiring Board Light Waveguide Mounting via Photo-Curing
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Solution Overview
Problem
The existing methods for mounting light waveguide paths on wiring boards, particularly using thermosetting resins, face challenges in achieving accurate mounting due to material expansion and deformation during the heating curing process, which complicates the integration of light and electrical components with high precision.
Innovation Solution
A method and apparatus that utilize a light-transmitting holder to position and bond a light-transmitting member, such as a light waveguide path, to a wiring board using a photo-curing resin, which is cured by light transmission through the holder, allowing for improved accuracy and avoiding the issues associated with thermosetting resins. This includes vacuum adsorption for precise placement and image recognition for enhanced positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting resin is used for mounting the light waveguide path, then the light waveguide path can be bonded to the wiring board, but the mounting accuracy deteriorates due to material expansion by heat during curing
Solution Approach 1:
The patent changes the curing method parameter from thermal curing (thermosetting resin) to photopolymerization curing (photo-curing resin). This parameter change eliminates heat-induced expansion while maintaining bonding capability, thereby resolving the contradiction between reliability and manufacturing precision
Solution Approach 2:
The patent replaces the thermal field (heat-based curing) with an optical field (light-based photopolymerization). This substitution eliminates the harmful thermal expansion effect while preserving the bonding function, thus improving mounting accuracy without sacrificing bonding reliability
2Reliability
If thermosetting resin is used for mounting, then bonding can be achieved, but positioning accuracy is difficult to control due to deformation by heating
Solution Approach 1:
The patent changes the curing mechanism from thermal reaction to photopolymerization reaction. This parameter change eliminates heating-induced deformation, enabling precise positioning control while maintaining adequate bonding strength through the photo-curing resin
Solution Approach 2:
The patent substitutes the thermal curing mechanism with a photopolymerization mechanism. This substitution eliminates the deformation problem caused by heating, allowing for better positioning accuracy control while preserving bonding reliability through the light-curing resin
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and apparatus enable the fabrication of wiring boards with light-transmitting members at high accuracy, achieving positional precision comparable to or better than ±5 μm, which is difficult with thermosetting resins, while facilitating the integration of light and electrical components with improved productivity and accuracy.
Implementation Method 1
a step of curing a photo-curing resin material between the light transmitting member and the wiring board main body by light transmitted through the light transmitting member and the holder
Implementation Method 2
when the light transmitting member is held by the holder by vacuum adsorption
Data Source
AI summary
There is provided a method for fabricating a wiring board including: a mounting step of mounting a light transmitting member, the mounting step including: an arranging step of holding the light transmitting member by light transmitting holder to arrange the light transmitting member at a wiring board main body, and a step of curing a photo-curing resin material between the light transmitting member and the wiring board main body by light transmitted through the light transmitting member and the holder.