Embedded Hybrid Electrical-Optical PCB Construct
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Solution Overview
Problem
Existing methods fail to create electrical and optical channels within the same physical layer of a printed circuit board (PCB) while maintaining cost-effectiveness and using existing manufacturing processes.
Innovation Solution
The implementation of embedded hybrid electrical-optical PCB constructs, which integrate electrical and optical channels within a single physical layer using an electrically conductive copper sheet and a reflective mesh adhesive layer, without increasing the PCB's cross-sectional height, utilizing existing manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electrical and optical channels are created within the same physical PCB layer, then integration density and functionality are improved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent merges electrical and optical channel creation into a single manufacturing process by applying reflective mesh adhesive simultaneously to both electrical traces and optical waveguide regions within the same PCB layer, eliminating the need for separate processing steps for each channel type
Solution Approach 2:
The reflective mesh adhesive serves multiple functions: it provides electrical connectivity for copper traces, creates optical reflection paths for waveguides, and acts as an adhesive bonding layer, thereby enabling a single material and process to handle both electrical and optical channel requirements
2Adaptability or versatility
If additional physical layers are added to PCB to accommodate both electrical and optical channels, then channel integration is improved, but PCB cross-section height and Z-axis dimensions increase
Solution Approach 1:
The patent transitions from a vertical stacking approach (adding Z-axis layers) to a planar integration approach by embedding both electrical and optical channels within the same PCB layer, utilizing the X-Y plane for dual-channel routing without increasing height
3Adaptability or versatility
If new manufacturing processes are developed to create embedded hybrid electrical-optical PCB structures, then structural integration is improved, but manufacturing cost and process development time increase
Solution Approach 1:
The existing copper traces and standard PCB manufacturing processes serve the dual purpose of electrical conduction and optical waveguide formation, with the reflective mesh adhesive automatically providing both electrical and optical functionality through its inherent reflective properties, eliminating the need for specialized self-service processes
Solution Approach 2:
The patent utilizes the inherent optical reflective properties of the metallic mesh in the adhesive layer, changing the functional interpretation of a standard electrical component (conductive mesh) to also serve optical purposes, thereby leveraging existing materials with modified parameter utilization rather than requiring new materials or processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of hybrid PCBs with integrated electrical and optical channels without increasing the PCB's Z-axis height, enhancing mechanical reliability, yield, and reducing costs while maintaining compatibility with existing manufacturing processes.
Implementation Method 1
The embedded hybrid electrical-optical PCB construct includes an electrically conductive sheet or a copper sheet, and a reflective mesh adhesive layer provided with the electrical channels and optical channels within the single physical PCB layer
Data Source
AI summary
Methods and structures are provided for implementing embedded hybrid electrical-optical printed circuit board (PCB) constructs. The embedded hybrid electrical-optical PCB construct includes electrical channels and optical channels within a single physical PCB layer. The embedded hybrid electrical-optical PCB construct includes an electrically conductive sheet or a copper sheet, and a reflective mesh adhesive layer provided with the electrical channels and optical channels within the single physical PCB layer.