Curved Heat Dissipation Structure for OLED Display Module
Solution Overview
Problem
The increasing power consumption in OLED display panels leads to significant heat dissipation challenges, with existing flat heat sink solutions providing limited improvement in heat dissipation efficiency.
Innovation Solution
A display module with a heat dissipation structure featuring a gap between the heat dissipation structure and the substrate, combined with a thermal conductive material, which increases the surface area for heat dissipation and enhances impact resistance by allowing the structure to absorb impact energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat heat dissipation structure is used, then the structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation structure employs a curved surface design instead of a flat surface. The curved surface increases the surface area in contact with the substrate, thereby improving heat dissipation efficiency while maintaining structural simplicity and ease of manufacture.
2Area of stationary object
If the heat dissipation structure is closely attached to the substrate, then the contact area is maximized, but the impact resistance is reduced
Solution Approach 1:
The curved surface design allows the heat dissipation structure to maintain good thermal contact with the substrate through surface conformity while providing cushioning space that enhances impact resistance. The curvature enables the structure to absorb impact energy more effectively.
Solution Approach 2:
The heat dissipation structure is designed with inherent cushioning capability through its curved geometry, providing beforehand protection against impacts. This cushioning effect allows the structure to withstand external forces better while maintaining thermal contact with the substrate.
3Power
If the power consumption of chips is increased, then the display performance is improved, but the heat dissipation problem becomes more prominent
Solution Approach 1:
The curved surface heat dissipation structure increases the effective heat transfer area between the heat dissipation structure and the substrate. This enhanced surface area improves heat dissipation efficiency, allowing higher chip power consumption to be managed effectively without excessive heat accumulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation efficiency and impact resistance of OLED display panels by increasing the surface area for heat transfer and providing effective buffering against impacts.
Implementation Method 1
The gap between the heat dissipation structure and the substrate is filled with a thermal conductive material
Data Source
AI summary
Provided is a display module. The display module includes: a display panel and a heat dissipation structure; wherein the display panel includes a substrate and a display substrate layer disposed on the substrate, and the heat dissipation structure is disposed on a side, distal from the display substrate layer, of the substrate; and a gap is formed between at least a partial region of the heat dissipation structure and the substrate.